Pulse reverse electrodeposition from a Kyoto perspective

Abstract

Using the Kyoto Protocol as a driver to find ways of reducing energy usage, a Life Cycle Analysis of producing copper, as an example of an energy intensive cycle, shows that if direct current plating of copper in rack plating of complex geometry parts is substituted by pulse reverse plating, not only is less copper deposited, and therefore consumed, but the energy efficiency of the process is also improved. In addition CO₂ emission reduction throughout the product chain is likely to be significant, as are improvements in waste reduction and pollution prevention.