Abstract
The graded structure of functionally graded materials can greatly reduce the residual thermal stress compared with non-graded interface of directly jointed materials. Finite element analysis was conducted to study the residual thermal stress induced on cooling from the sintering temperature of Ti3SiC2–(Ti3SiC2–SiC) FMGs. For a circular disk shaped specimen with a fixed geometric size of Ti3SiC2–(Ti3SiC2–SiC) FMGs, optimum grade layer number N as well as composition distribution exponent p for minimising residual stress is identified. The simulation results indicated that the optimum layer number N and composition distribution exponent p can not only reduce the stress level, but also make the stress distribute more uniformly.