Effects of residual porosity on strength of Sn–Pb/Cu₆ Sn₅ particulate composites

Abstract

The effect of residual porosity on the flow stress of particulate composites was studied for a composite in which it is possible to create high porosity (>60%) by using particle coatings. The material was a eutectic composition Sn–Pb solder with additions of intermetaliic CU₆Sn₅ particles. It was found that porosity affects the strength of these composites much less than for non-composites, an effect attributed to particle bonding during solidification. At the same time, residual porosity was found to inhibit strongly or even to prevent hardening of this material. A micromechanical model is developed which simulates this behaviour over a wide range of porosities.

MST/1928