Correlation Between Hysteresis Loop Areas of Lower Punch and of Die Pressures Versus Upper Punch Pressures

Abstract

In tablet compression a series of authors (1-11) have employed plots of die wall pressure as a function of applied pressure to elucidate the mechanism of bonding in the compact (Fig. 1). The so-called compression cycles have been the subject of an article by Carstensen and Toure (12, 13) in which it was shown that the hysteresis area (rather than the loop itself) was a good parameter of scrutiny for the mechanism of bonding.