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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 36, 1959 - Issue 1
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Original Articles

Electrodeposition of Copper-Nickel Alloys from Citrate Solutions

B. H. Priscott
, B.Sc., A.R.I.C.
Pages 93-96 | Published online: 09 May 2017

Citations (18)

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M. H. Fawzy, M. M. Ashour & A. M. Abd El-Halim. (1998) Effect of Superimposed Sinusoidal a.c. on the Characteristics of Electrodeposited Ni, Cu and Cu-Ni Alloy Composites with α-Al2O3 and TiO2. Transactions of the IMF 76:5, pages 193-202.
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Articles from other publishers (17)

F. Geramipour, S.M. Mousavi Khoei & H. Shooshtari Gugtapeh. (2021) Effect of shaped waveform on structure and electrochemical corrosion behavior of pulse electrodeposited Ni Cu alloy coatings. Surface and Coatings Technology 424, pages 127643.
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Srinivas Palli & Suhash R. Dey. (2017) Numerical simulation and experimental investigation of combinatorial electrodeposition of Ni-Cu material library using modified Hull cell. physica status solidi (a) 214:10, pages 1700084.
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S. M. Silaimani, G. Vivekanandan & P. Veeramani. (2014) Nano-nickel–copper alloy deposit for improved corrosion resistance in marine environment. International Journal of Environmental Science and Technology 12:7, pages 2299-2306.
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V. Zin, K. Brunelli & M. Dabalà. (2014) Characterization of Cu–Ni alloy electrodeposition and synthesis of nanoparticles by pulsed sonoelectrochemistry. Materials Chemistry and Physics 144:3, pages 272-279.
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Palli Srinivas, Sven Hamann, Matthias Wambach, Alfred Ludwig & Suhash R. Dey. (2014) Fabrication of a Ni-Cu Thin Film Material Library Using Pulsed Electrodeposition. Journal of The Electrochemical Society 161:10, pages D504-D509.
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Umut Sarac, R. Mustafa Öksüzoğlu & M. Celalettin Baykul. (2012) Deposition potential dependence of composition, microstructure, and surface morphology of electrodeposited Ni–Cu alloy films. Journal of Materials Science: Materials in Electronics 23:12, pages 2110-2116.
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P. Calleja, J. Esteve, P. Cojocaru, L. Magagnin, E. Vallés & E. Gómez. (2012) Developing plating baths for the production of reflective Ni–Cu films. Electrochimica Acta 62, pages 381-389.
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A. Ollivier, L. Muhr, S. Delbos, P. P. Grand, M. Matlosz & E. Chassaing. (2009) Copper–nickel codeposition as a model for mass-transfer characterization in copper–indium–selenium thin-film production. Journal of Applied Electrochemistry 39:12, pages 2337-2344.
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I. Baskaran, T.S.N. Sankara Narayanan & A. Stephen. (2006) Pulsed electrodeposition of nanocrystalline Cu–Ni alloy films and evaluation of their characteristic properties. Materials Letters 60:16, pages 1990-1995.
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A. Lozano-Morales, J. Fitzgerald, V. Singh, X. Xie & E. J. Podlaha. (2006) Electrodeposition of Cu–Al[sub 2]O[sub 3] Thin Films and Microposts in Ammonia-Citrate Electrolytes. Journal of The Electrochemical Society 153:8, pages C567.
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Sabine Rode, Christophe Henninot & Michael Matlosz. (2005) Complexation Chemistry in Nickel and Copper-Nickel Alloy Plating from Citrate Baths. Journal of The Electrochemical Society 152:4, pages C248.
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Sabine Rode, Christophe Henninot, Cécile Vallières & Michael Matlosz. (2004) Complexation Chemistry in Copper Plating from Citrate Baths. Journal of The Electrochemical Society 151:6, pages C405.
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Ch. Bonhôte & D. Landolt. (1997) Microstructure of NiCu multilayers electrodeposited from a citrate electrolyte. Electrochimica Acta 42:15, pages 2407-2417.
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E.J. Podlaha, Ch. Bonh?te & D. Landolt. (1994) A mathematical model and experimental study of the electrodeposition of Ni?Cu alloys from complexing electrolytes. Electrochimica Acta 39:18, pages 2649-2657.
Crossref
R. PINNER. 1994. Corrosion. Corrosion 13:71 13:77 .
R. PINNER. 1976. Corrosion. Corrosion 14:62 14:68 .
Abner Brenner. 1963. Electrodeposition of Alloys. Electrodeposition of Alloys 558 584 .

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