Publication Cover
Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 65, 1987 - Issue 1
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Original Articles

Whisker growth on tin electrodeposits

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J. Glazer. (1995) Metallurgy of low temperature Pb-free solders for electronic assembly. International Materials Reviews 40:2, pages 65-93.
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Articles from other publishers (7)

D. Wu, T.A. Lograsso & J.W. Anderegg. (2007) Migration, Formation, and Growth of Pure Cd Whiskers in Cd-Based Compounds. Journal of Electronic Materials 36:5, pages 555-561.
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B.H. Chudnovsky, D.L. Swindler & J.R. Thompson. (2002) A touch of gray [power contacts, silver corrosion, whiskers growth]. IEEE Industry Applications Magazine 8:5, pages 45-52.
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B.H. Chudnovsky. (2002) Degradation of power contacts in industrial atmosphere: silver corrosion and whiskers. Degradation of power contacts in industrial atmosphere: silver corrosion and whiskers.
B.H. Chudnovsky, D.L. Swindler & J.R. Thompson. (2001) Silver whiskers growth on power contacts in corrosive industrial atmospheres. Silver whiskers growth on power contacts in corrosive industrial atmospheres.
B.H. Chudnovsky, D.L. Swindler & J.R. Thompson. (2001) Silver corrosion and whiskers growth on power contacts in industrial atmosphere of pulp and paper plants. Silver corrosion and whiskers growth on power contacts in industrial atmosphere of pulp and paper plants.
Lewis S. Goldmann, Robert T. Howard & Dexter A. Jeannotte. 1997. Microelectronics Packaging Handbook. Microelectronics Packaging Handbook 404 555 .
Dexter A. Jeannotte, Lewis S. Goldmann & Robert T. Howard. 1988. Microelectronics Packaging Handbook. Microelectronics Packaging Handbook 225 359 .

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