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Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 80, 2002 - Issue 2
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Original Articles

Development of a Non- cyanide Alkaline Bath for Industrial Copper Plating

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Pages 37-39 | Published online: 08 May 2017

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Read on this site (2)

R. Sekar, K. K. Jagadesh & G. N. K. Ramesh Bapu. (2015) Electrodeposition and characterisation of copper deposits from non-cyanide electrolytes. Surface Engineering 31:6, pages 433-438.
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P. Sivasakthi, R. Sekar & G. N. K. Ramesh Bapu. (2015) Electrodeposition and characterisation of copper deposited from cyanide-free alkaline glycerol complex bath. Transactions of the IMF 93:1, pages 32-37.
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Articles from other publishers (4)

Naveen Bharadishettar & K. Udaya Bhat. (2023) Effect of acid pickling treatment of stainless steel substrate on adhesion strength of electrodeposited copper coatings using non-cyanide electrolyte. International Journal of Adhesion and Adhesives 127, pages 103518.
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Naveen Bharadishettar, K. Udaya Bhat & K. Spandana Bhat. (2023) Development of adherent antimicrobial copper coatings on stainless steel for healthcare applications. Journal of Materials Science 58:40, pages 15805-15827.
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R. SEKAR. (2017) Synergistic effect of additives on electrodeposition of copper from cyanide-free electrolytes and its structural and morphological characteristics. Transactions of Nonferrous Metals Society of China 27:7, pages 1665-1676.
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Jie Zhang, Anmin Liu, Xuefeng Ren, Jinqiu Zhang, Peixia Yang & Maozhong An. (2014) Electrodeposit copper from alkaline cyanide-free baths containing 5,5′-dimethylhydantoin and citrate as complexing agents. RSC Adv. 4:72, pages 38012-38026.
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