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Publication Cover
Transactions of the IMF
The International Journal of Surface Engineering and Coatings
Volume 80, 2002 - Issue 2
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Original Articles

Internal Stress in Electrodeposited Nanocrystalline Ni-Cu Alloys

S.K. GhoshMaterials Processing Division, Bhabha Atomic Research Centre, Mumbai-400 085, India
,
A.K. GroverMaterials Processing Division, Bhabha Atomic Research Centre, Mumbai-400 085, India
&
M.K. TotlaniMaterials Processing Division, Bhabha Atomic Research Centre, Mumbai-400 085, India
Pages 56-59 | Published online: 08 May 2017

Citations (8)

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Read on this site (2)

S. K. Ghosh, P. K. Limaye, C. Srivastava & R. Tewari. (2010) Comparison of sliding wear behaviour of pulse electrodeposited Ni–Cu nanocrystalline alloys and Ni–Cu/Cu multilayers. Transactions of the IMF 88:3, pages 158-162.
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J. P. G. Farr. (2008) Pulse plating in third millennium. Transactions of the IMF 86:2, pages 83-86.
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Articles from other publishers (6)

László PéterLászló Péter. 2021. Electrochemical Methods of Nanostructure Preparation. Electrochemical Methods of Nanostructure Preparation 183 216 .
Jian-Hong Ye, Chao-Kuang Cheng, Jeng-Yu Lin, Chi-Hsien Huang, Tsung-Kuang Yeh & Chien-Kuo Hsieh. (2020) Potential-controlled pulse electrochemical deposition of poly nanostructural two-dimensional molybdenum disulfide thin films as a counter electrode for dye-sensitized solar cells. Surface and Coatings Technology 394, pages 125855.
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Luisa Peraldo Bicelli, Benedetto Bozzini, Claudio Mele & Lucia D'Urzo. (2008) A Review of Nanostructural Aspects of Metal Electrodeposition. International Journal of Electrochemical Science 3:4, pages 356-408.
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S.K. Ghosh, P.K. Limaye, S. Bhattacharya, N.L. Soni & A.K. Grover. (2007) Effect of Ni sublayer thickness on sliding wear characteristics of electrodeposited Ni/Cu multilayer coatings. Surface and Coatings Technology 201:16-17, pages 7441-7448.
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S.K. Ghosh, P.K. Limaye, B.P. Swain, N.L. Soni, R.G. Agrawal, R.O. Dusane & A.K. Grover. (2007) Tribological behaviour and residual stress of electrodeposited Ni/Cu multilayer films on stainless steel substrate. Surface and Coatings Technology 201:8, pages 4609-4618.
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S.K. Ghosh, G.K. Dey, R.O. Dusane & A.K. Grover. (2006) Improved pitting corrosion behaviour of electrodeposited nanocrystalline Ni–Cu alloys in 3.0wt.% NaCl solution. Journal of Alloys and Compounds 426:1-2, pages 235-243.
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