Citations (7)
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Du-Ming Tsai & Yan-Jheng Su. (2009) Non-referential, self-compared shape defect inspection for bond pads with deformed shapes. International Journal of Production Research 47:5, pages 1225-1244.
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Chi-Hao Yeh. (2002) Ball grid array (BGA) substrate conduct paths inspection using two-dimensional wavelet transform. International Journal of Production Research 40:18, pages 4675-4695.
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Articles from other publishers (5)
Liang Gao, Gang Wang & Jinhai Liu. (2015) Image denoising based on edge detection and prethresholding Wiener filtering of multi-wavelets fusion. International Journal of Wavelets, Multiresolution and Information Processing 13:05, pages 1550031.
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W C Li, Y T Lin, J J Jeng & C L Chang. (2014) Deposition uniformity inspection in IC wafer surface. Journal of Physics: Conference Series 483, pages 012022.
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Ya‐Hui Tsai, Du‐Ming Tsai, Wei‐Chen Li, Wei‐Yao Chiu & Ming‐Chin Lin. (2011) Surface defect detection of 3D objects using robot vision. Industrial Robot: An International Journal 38:4, pages 381-398.
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Chi-Hao Yeh, Ful-Chiang Wu, Wei-Lung Ji & Chien-Yi Huang. (2010) A Wavelet-Based Approach in Detecting Visual Defects on Semiconductor Wafer Dies. IEEE Transactions on Semiconductor Manufacturing 23:2, pages 284-292.
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Wen-Bing HORNG & Chun-Wen CHEN. (2009) Revision of Using Eigenvalues of Covariance Matrices in Boundary-Based Corner Detection. IEICE Transactions on Information and Systems E92-D:9, pages 1692-1701.
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