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Original Articles

Non-referential, self-compared shape defect inspection for bond pads with deformed shapes

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Pages 1225-1244 | Received 30 Jan 2007, Accepted 27 Jun 2007, Published online: 26 Nov 2008

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Der-Baau Perng, Shu-Ming Lee & Cheng-Chuan Chou. (2010) Automated bonding position inspection on multi-layered wire IC using machine vision. International Journal of Production Research 48:23, pages 6977-7001.
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Yuan-Shyi ChiuPeterPeter, Yu-Kai Lin & Hong-Dar Lin. (2020) Effective image models for inspecting profile flaws of car mirrors with applications. Journal of Applied Engineering Science 18:1, pages 81-91.
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Wen-Yen Wu, Ching-Wen Hung & Wen-Bin Yu. (2013) The development of automated solder bump inspection using machine vision techniques. The International Journal of Advanced Manufacturing Technology 69:1-4, pages 509-523.
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