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International Journal of Production Research Volume 55, 2017 - Issue 9
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Original Articles

On an IC wire bonding machine production–inventory problem with time value of money

Dah-Chuan GongDepartment of Industrial and Business Management, Chang Gung University, Guishan, Taiwan, ROCCorrespondence[email protected]
,
Jia-Lun KangDepartment of Industrial and Systems Engineering, Chung Yuan Christian University, Chungli, Taiwan, ROC
,
Gary C. LinDepartment of Industrial & Manufacturing Engineering & Technology, Bradley University, Peoria, IL, USA
&
T. C. HouDepartment of Industrial and Systems Engineering, Chung Yuan Christian University, Chungli, Taiwan, ROC
Pages 2431-2453 | Received 01 Jun 2015, Accepted 07 Jul 2016, Published online: 02 Aug 2016

Citations (4)

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Read on this site (1)

Junlong Chen, Zijun Zhang & Feng Wu. (2021) A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects. International Journal of Production Research 59:16, pages 4779-4793.
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Articles from other publishers (3)

Yinfeng Xu, Rongteng Zhi, Feifeng Zheng & Ming Liu. (2021) Parallel Machine Scheduling with Due Date-to-Deadline Window, Order Sharing and Time Value of Money. Asia-Pacific Journal of Operational Research 39:02.
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Rongteng Zhi, Yinfeng Xu & Feifeng Zheng. (2019) Single Machine Scheduling Considering Time Value of Money. IFAC-PapersOnLine 52:13, pages 887-892.
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Dezhi Su, Changcheng Wang, Dan Zhao, Yucheng Niu, Quanwen Wang & Peijie Guan. (2018) Study of capillary tip states on the reliability of Al wire bonding in microelectronic package. Study of capillary tip states on the reliability of Al wire bonding in microelectronic package.

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