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Original Articles

DILATOMETRIC STUDY OF THE EFFECTS OF CURE PROFILES, FILLERS, AND MOLD CONSTRAINTS IN A MODEL EPOXY

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Pages 1079-1101 | Received 01 Apr 2003, Accepted 01 Mar 2004, Published online: 10 Aug 2010

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Read on this site (2)

HitendraK. Singh, Kai-Tak Wan, JohnG. Dillard, DavidA. Dillard, Paul Reboa, Joshua Smith, Ellen Chappell & Alok Sharan. (2008) Subcritical Delamination in Epoxy Bonds to Silicon and Glass Adherends: Effect of Temperature and Preconditioning. The Journal of Adhesion 84:7, pages 619-637.
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E. P. O'Brien & T. C. Ward. (2005) Novel capacitance sensor design for measuring coating debonding: the effects of thermal-hygroscopic cycling. Journal of Adhesion Science and Technology 19:16, pages 1409-1426.
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Articles from other publishers (1)

Sandra L. Case, Emmett P. O'Brien & Thomas C. Ward. (2005) Cure profiles, crosslink density, residual stresses, and adhesion in a model epoxy. Polymer 46:24, pages 10831-10840.
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