Advanced search
Publication Cover
The Journal of Adhesion Volume 90, 2014 - Issue 11
Submit an article Journal homepage
132
Views
5
CrossRef citations to date
0
Altmetric
Original Articles

Analysis of the Influence of Geometric Parameters on the Stress Distributions in Adhesively Bonded Scarf Joints Using 2D Models Under Elastic Assumption

Jean-Yves Cognard Laboratoire Brestois de Mécanique et des Systèmes, ENSTA Bretagne, Brest, FranceCorrespondence[email protected]
,
Dominique Leguillon Institut JLRA, CNRS, Université Pierre et Marie Curie, Paris, France
&
Nicolas Carrere Laboratoire Brestois de Mécanique et des Systèmes, ENSTA Bretagne, Brest, France
Pages 877-898 | Received 19 Dec 2012, Accepted 26 Sep 2013, Published online: 20 May 2014

Citations (5)

Keep up to date with the latest research on this topic with citation updates for this article.

Subscribe to citation updates

Read on this site (1)

S. O. Olajide, E. Kandare & A. Afaghi Khatibi. (2017) Fatigue life uncertainty of adhesively bonded composite scarf joints – an airworthiness perspective. The Journal of Adhesion 93:7, pages 515-530.
Read now

Articles from other publishers (4)

Hetram Sonwani, M. Ramji & Sai Sidhardh. (2023) Modeling of adhesively bonded single scarf CFRP joint behavior using energy-based approach. Composite Structures, pages 116950.
Crossref
P.F. Liu & J.W. Liu. (2022) Finite element analysis of competitive damage mechanisms of composite scarf adhesive joints by considering thickness effect. Theoretical and Applied Fracture Mechanics 119, pages 103347.
Crossref
Nicolas Carrere, Claudiu Badulescu, Jean-Yves Cognard & Dominique Leguillon. (2015) 3D models of specimens with a scarf joint to test the adhesive and cohesive multi-axial behavior of adhesives. International Journal of Adhesion and Adhesives 62, pages 154-164.
Crossref
Sung Jin Kim, Young Soo Kim, Chong K. Yoon, Venky Sundaram & Rao Tummala. (2015) A novel non-solder based board-to-board interconnection technology for smart mobile and wearable electronics. A novel non-solder based board-to-board interconnection technology for smart mobile and wearable electronics.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Order Reprints Request Corporate Permissions

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

Request Academic Permissions

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.

Related research

People also read lists articles that other readers of this article have read.

Recommended articles lists articles that we recommend and is powered by our AI driven recommendation engine.

Cited by lists all citing articles based on Crossref citations.
Articles with the Crossref icon will open in a new tab.