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Original Articles

Analysis of the Molecular Structure at the PPS/Copper Interphase and its Role in Adhesion

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Pages 229-244 | Received 27 Jun 1994, Accepted 21 Apr 1995, Published online: 24 Sep 2006

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Kilwon Cho & Eun Chul Cho. (2000) Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints . Journal of Adhesion Science and Technology 14:11, pages 1333-1353.
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B.J. Love, J. Baborowski, M. Charbonnier & M. Romand. (1999) Surface Chemical Characterization of Copper Oxide and its Relationship to Adhesion in Formed Epoxy/Copper Interfaces. The Journal of Adhesion 69:1-2, pages 165-179.
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Articles from other publishers (1)

Philipp Nothdurft, Gisbert Riess & Wolfgang Kern. (2019) Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms. Materials 12:3, pages 550.
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