Quantitative Examination of Photofabricated Profiles. Part 3. Measurement of Etch FactorFootnote
Some authors have used the inverse function (undercut/depth) but the form chosen here has the logical advantage of high etch factors indicating good performance.

D. M. AllenSchool of Production Studies, Cranfield Institute of Technology, Cranfield, Bedford MK43

D. F. HorneSchool of Production Studies, Cranfield Institute of Technology, Cranfield, Bedford MK43

G. W. W. StevensSchool of Production Studies, Cranfield Institute of Technology, Cranfield, Bedford MK43

Citations (4)

Keep up to date with the latest research on this topic with citation updates for this article.

Read on this site (1)

D. M. Allen, A. J. Hegarty & D. F. Horne. (1981) Surface Textures of Annealed AISI 304 Stainless Steel Etched by Aqueous Ferric Chloride—Hydrochloric Acid Solutions. Transactions of the IMF 59:1, pages 25-29.
Read now

Articles from other publishers (3)

Raghied M. Atta. (2022) Effect of applying air pressure during wet etching of micro copper PCB tracks with ferric chloride. International Journal of Materials Research 113:9, pages 795-808.
Crossref

C Vuik & C Cuvelier. (1985) Numerical solution of an etching problem. Journal of Computational Physics 59:2, pages 247-263.
Crossref

D. F. Horne. (1981) Optical scales, reticles, gratings, masks, and standards. Applied Optics 20:23, pages 4000.
Crossref

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Order Reprints Request Corporate Permissions

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

Request Academic Permissions

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.

Quantitative Examination of Photofabricated Profiles. Part 3. Measurement of Etch FactorFootnote
Some authors have used the inverse function (undercut/depth) but the form chosen here has the logical advantage of high etch factors indicating good performance.

Articles from other publishers (3)

Information for

Open access

Opportunities

Help and information

Your download is now in progress and you may close this window

Login or register to access this feature

Quantitative Examination of Photofabricated Profiles. Part 3. Measurement of Etch FactorFootnoteSome authors have used the inverse function (undercut/depth) but the form chosen here has the logical advantage of high etch factors indicating good performance.

Citations (4)

Read on this site (1)

Articles from other publishers (3)

Reprints and Corporate Permissions

Academic Permissions

Related research

To cite this article:

Download citation

Information for

Open access

Opportunities

Help and information

Keep up to date

Quantitative Examination of Photofabricated Profiles. Part 3. Measurement of Etch FactorFootnote
Some authors have used the inverse function (undercut/depth) but the form chosen here has the logical advantage of high etch factors indicating good performance.