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Technometrics Volume 65, 2023 - Issue 1
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Articles

Label-Noise Robust Deep Generative Model for Semi-Supervised Learning

Heegeon YoonDepartment of Industrial and Systems Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of KoreaView further author information
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Heeyoung KimDepartment of Industrial and Systems Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of KoreaCorrespondence[email protected]
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Pages 83-95 | Received 29 Jun 2021, Accepted 11 May 2022, Published online: 06 Jun 2022

Citations (7)

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Read on this site (2)

Sumin Kim & Heeyoung Kim. Mixed-type defect pattern recognition in noisy labeled wafer bin maps. Quality Engineering 0:0, pages 1-15.
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Jeongman Choi, Eun-Yeol Ma & Heeyoung Kim. Simultaneous classification and out-of-distribution detection for wafer bin maps. Quality Engineering 0:0, pages 1-13.
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Articles from other publishers (5)

Hyeonwoo Kim, Heegeon Yoon & Heeyoung Kim. (2024) Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning. Journal of Manufacturing Science and Engineering 146:7.
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Hyuck Lee, Hyeonwoo Kim & Heeyoung Kim. (2024) Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels. Journal of Manufacturing Science and Engineering 146:7.
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Jiayi Zhao & Guangxue Li. (2023) A combined deep neural network and semi-supervised clustering method for sports injury risk prediction. Alexandria Engineering Journal 80, pages 191-201.
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Hunsung Cho, Wonmo Koo & Heeyoung Kim. (2023) Prediction of Highly Imbalanced Semiconductor Chip-Level Defects in Module Tests Using Multimodal Fusion and Logit Adjustment. IEEE Transactions on Semiconductor Manufacturing 36:3, pages 425-433.
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Minghui Liu, Meiyi Yang, Jiali Deng, Xuan Cheng, Tianshu Xie, Pan Deng, Haigang Gong, Ming Liu & Xiaomin Wang. (2023) Feature Equilibrium: An Adversarial Training Method to Improve Representation Learning. International Journal of Computational Intelligence Systems 16:1.
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