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M. Lionel Bender, Michael A. Cavanagh, Anthony R Grant, Anthony R Grant, Kleanthes K. Grohmann, John Hewson, Alan S. Kaye, Ursula Lenker, Kanavillil Rajagopalan, Kanavillil Rajagopalan, Kanavillil Rajagopalan, Kanavillil Rajagopalan, Solomon I. Sara$suffix/text()$suffix/text(), Jyh Wee Sew, Jacob J. Spa, Jacob J. Spa, Yuri Tambovtsev, Edward J. Vajda, Edward J. Vajda, Edward J. Vajda, Edward J. Vajda, Elly van Gelderen, Heinrich Werner & Søren Wichmann. (2005) Reviews. WORD 56:3, pages 421-508.
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Matthew Carter. (2023) Polyfunctional argument markers in Ket. Morphology 33:2, pages 67-113.
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Edward Vajda. Typology of the Ket finite verb. Typology of the Ket finite verb.
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Norio KANEKO, Motoyasu KOMATSU, Tadashi KURASHINASusumu ARAI & Naoyuki SHINOHARA. (2005) Sn-Ag-Cu Alloy Electroplating from Acid Sulfate Baths for Pb-free Solder鉛フリーはんだ接合に対応した硫酸浴からのSn-Ag-Cu合金めっき. Electrochemistry 73:11, pages 951-955.
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Norio KANEKO, Masako SEKI, Susumu ARAI & Naoyuki SHINOHARA. (2003) Sn-Cu Solder Bump Formation from Acid Sulfate Baths Using Electroplating Method電気めっき法による硫酸浴からのSn-Cuはんだバンプの作製. Electrochemistry 71:9, pages 791-794.
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