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Original Articles

Hillock growth kinetics in thin Pb-In-Au films

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Pages 583-599 | Received 31 Oct 1985, Accepted 12 May 1986, Published online: 27 Sep 2006

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F. M. d'Heurle. (1989) Metallurgical topics in silicon device interconnections: Thin film stresses. International Materials Reviews 34:1, pages 53-68.
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Yongzhi Shi, Zhenyu Jiang, Wenjie Zhang, Xinyu Ren, Meiqi Wang, Lisha Liang & Kaigui Zhu. (2024) A comparison between deuterium plasma induced blistering of tungsten surface and hillocks grown on tungsten thin film. Journal of Nuclear Materials 590, pages 154879.
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Yuuki Araga, Hiroshi Nakagawa, Masaru Hashino & Katsuya Kikuchi. (2023) Demonstration of 90 000 superconductive bump connections for massive quantum computing. Japanese Journal of Applied Physics 62:SC, pages SC1094.
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Chang-Shuo Chang, Tse-Chang Li, Yi-Chan Tsai, Gien-Huang Wu & Jen-Fin Lin. (2018) Effects of deposition method and conditions for IGZO film and thermal annealing on composite film quality, surface roughness, microstructural defects, and electrical properties of Ti/IGZO/graphene/polyimide specimens. Journal of Alloys and Compounds 768, pages 298-315.
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Tse-Chang Li, Ba-Son Nguyen, Yu-Ching Chiang, Ching-Lin Hsiao & Jen-Fin Lin. (2017) Effects of deposition power of IGZO film and graphene layer in IGZO/graphene + Ni/SiO2/Si wafer specimens on the mechanical and electrical properties in tribotests. Surface and Coatings Technology 315, pages 44-60.
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Tse-Chang Li, Ba-Son Nguyen, Yu-Ching Chiang, Ching-Lin Hsiao & Jen-Fin Lin. (2016) Effects of graphene layers in IGZO / graphite-like +Ni/SiO_2/Si wafer specimens on electrical and optical properties in tribotests. Optical Materials Express 6:12, pages 3857.
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Tse-Chang Li, Ming Tsung Kao & Jen Fin Lin. (2014) Effects of deposition and annealing conditions on the defects in the Al/glass composites of TFT specimens. Journal of Materials Science: Materials in Electronics 25:10, pages 4425-4433.
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M. Parvizian, F. Rahimi-Ashtari, A. Goodarzi, B. Sabrloui, J. Sabaghzade & M.S. Zabihi. (2012) Residual stress improvement of platinum thin film in Au/Pt/Ti/p-GaAs ohmic contact by RF sputtering power. Applied Surface Science 260, pages 77-79.
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Ming Tsung Kao & Jen Fin Lin. (2012) Effects of deposition conditions of the Al film in Al/glass specimens and annealing conditions on internal stresses and hillock formations. Thin Solid Films 520:16, pages 5353-5360.
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Cheng Chang Peng, Chen Kuei Chung & Jen Fin Lin. (2011) Effects of Al film thickness and annealing temperature on the aluminum-induced crystallization of amorphous silicon and carrier mobility. Acta Materialia 59:15, pages 6093-6102.
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Ming Tsung Kao & Jen Fin Lin. (2010) Electrical properties of AlNx/Al/Mo composite film prepared for use in thin-film transistors. Thin Solid Films 518:14, pages 3917-3922.
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Yves Pauleau. 2002. Handbook of Thin Films. Handbook of Thin Films 455 522 .
Deok-kee Kim, William D. Nix, Richard P. Vinci, Michael D. Deal & James D. Plummer. (2001) Study of the effect of grain boundary migration on hillock formation in Al thin films. Journal of Applied Physics 90:2, pages 781-788.
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G. S. Was, D. J. Srolovitz, Z. Ma & D. Liang. (2011) Microstructure Control for Thin Film Metallization. MRS Proceedings 441.
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K. Bickmann & J. Hauck. (2011) Lattice distortion of thick epitaxial layers. Journal of Materials Research 11:1, pages 50-54.
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F.Y. Génin. (1995) The initial stages of the formation of holes and hillocks in thin films under equal biaxial stress. Acta Metallurgica et Materialia 43:12, pages 4289-4300.
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Eiji Iwamura, Takashi Ohnishi & Kazuo Yoshikawa. (1995) A study of hillock formation on AlTa alloy films for interconnections of TFT-LCDs. Thin Solid Films 270:1-2, pages 450-455.
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D. J. Srolovitz, W. Yang & M. G. Goldiner. (2011) Thermodynamics of Hole and Hillock Growth in Thin Films. MRS Proceedings 403.
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François Y. Genin. (2011) Analytical and Numerical Modeling of Surface Morphologies in Thin Films. MRS Proceedings 389.
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K. Bickmann & J. Hauck. (1995) Strain in thick epitaxial layers. Thin Solid Films 254:1-2, pages 39-46.
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S.K. Lahiri. (1994) Mechanical stress induced void and hillock formations in thin films. Mechanical stress induced void and hillock formations in thin films.
H.-D. Hartmann & T. Hillmann-Ruge. (1991) Accelerated life time tests of laser formed vertical links of standard CMOS double level metallizations. Accelerated life time tests of laser formed vertical links of standard CMOS double level metallizations.
K. Sreenivas, M. Sayer & Paul Garrett. (1989) Properties of D.C. magnetron-sputtered lead zirconate titanate thin films. Thin Solid Films 172:2, pages 251-267.
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F.M. D'Heurle & J.M.E. Harper. (1989) Note on the origin of intrinsic stresses in films deposited via evaporation and sputtering. Thin Solid Films 171:1, pages 81-92.
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