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G. Dehm, M. Rühle, G. Ding & R. Raj. (1995) Growth and structure of copper thin films deposited on (0001) sapphire by molecular beam epitaxy. Philosophical Magazine B 71:6, pages 1111-1124.
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Read now
Articles from other publishers (24)
Ömer Barışkan Yasan, Sedat Özden & Fehmi Nair. (2023) Investigation of the mechanical properties of the diffusion welded copper wires stacked in the same direction. Journal of Mechanical Science and Technology 37:1, pages 127-137.
Crossref
Crossref
Christina Scheu, Wilhelm Stein, Saskia Klein, Thomas Wagner, Antoni P. Tomsia & Manfred Rühle. (2022)
Microstructure and Modifications of Cu/Al
2
O
3
Interfaces
. International Journal of Materials Research 92:7, pages 707-711.
Crossref
Crossref
M. Guedes, J. M. F. Ferreira & A. C. Ferro. (2012)
Reaction Mechanisms in
Al
2
O
3
/
CuO
Infiltration by Liquid
Al
. Journal of the American Ceramic Society 95:10, pages 3064-3070.
Crossref
Crossref
Shun-Ichiro Tanaka. (2009) Direct bonding of Cu to oxidized silicon nitride by wetting of molten Cu and Cu(O). Journal of Materials Science 45:8, pages 2181-2187.
Crossref
Crossref
A. Shrestha, R. Asthana, T. K. Lacksonen & M. Singh. (2009) Synthesis and Characterization of Air-Sintered Al2O3-Bronze Composites. Journal of Materials Engineering and Performance 18:8, pages 1041-1045.
Crossref
Crossref
C. Scheu, M. Gao, S. H. Oh, G. Dehm, S. Klein, A. P. Tomsia & M. Rühle. (2006) Bonding at copper–alumina interfaces established by different surface treatments: a critical review. Journal of Materials Science 41:16, pages 5161-5168.
Crossref
Crossref
A Krzyńska, W Włosiński & M Kaczorowski. (2006)
About the Structure Cu-Al
2
O
3
Joints Obtained by Diffusion Bonding
. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 220:3, pages 439-445.
Crossref
Crossref
C. Scheu, S. Klein, A. P. Tomsia & M. Rühle. (2002)
Chemical reactions and morphological stability at the Cu/Al
2
O
3
interface
. Journal of Microscopy 208:1, pages 11-17.
Crossref
Crossref
Weiping Liu, G. Elssner & M. Rühle. (2001) Effects of thin film Nb interlayer in Cu/sapphire bonds. Materials Science and Engineering: A 317:1-2, pages 153-162.
Crossref
Crossref
Christina Scheu, Gerhard Dehm & Wayne D. Kaplan. (2004) Equilibrium Amorphous Silicon–Calcium–Oxygen Films at Interfaces in Copper–Alumina Composites Prepared by Melt Infiltration. Journal of the American Ceramic Society 84:3, pages 623-630.
Crossref
Crossref
Kevin P. Trumble. (2004) Prediction of a Critical Temperature for Aluminate Formation in Alumina/Copper–Oxygen Eutectic Bonding. Journal of the American Ceramic Society 82:10, pages 2919-2920.
Crossref
Crossref
Matthias Diemer, Achim Neubrand, Kevin P. Trumble & Jürgen Rödel. (2004) Influence of Oxygen Partial Pressure and Oxygen Content on the Wettability in the Copper–Oxygen–Alumina System. Journal of the American Ceramic Society 82:10, pages 2825-2832.
Crossref
Crossref
Toru Fujimura & Shun-ichiro Tanaka. (1998) In-situ high temperature X-ray diffraction study of Cu/Al2O3 interface reactions. Acta Materialia 46:9, pages 3057-3061.
Crossref
Crossref
M. Rühle, A. Liedtke, U. Alber, R. Schweinfest & G. Elßner. 1998. Interfacial Science in Ceramic Joining. Interfacial Science in Ceramic Joining
3
14
.
P.H. Bolt, F.H.P.M. Habraken & J.W. Geus. (1998) Formation of Nickel, Cobalt, Copper, and Iron Aluminates fromα- andγ-Alumina-Supported Oxides: A Comparative Study. Journal of Solid State Chemistry 135:1, pages 59-69.
Crossref
Crossref
Ivar E. Reimanis, Kevin P. Trumble, Kirk A. Rogers & Brian James Dalgleish. (2005)
Influence of Cu
2
O and CuAlO
2
Interphases on Crack Propagation at Cu/α‐Al
2
O
3
Interfaces
. Journal of the American Ceramic Society 80:2, pages 424-432.
Crossref
Crossref
D.L. Beke & Yu.S. Kaganovskii. (1995) Determination of parameters of surface mass transport from morphological changes of beaded thin films. Materials Science and Engineering: B 32:3, pages 185-199.
Crossref
Crossref
F. Ernst. (1995) Metal-oxide interfaces. Materials Science and Engineering: R: Reports 14:3, pages 97-156.
Crossref
Crossref
Kirk A. Rogers, Kevin P. Trumble, Brian J. Dalgleish & Ivar E. Reimanis. (2005)
Role of Oxygen in Microstructure Development at Solid‐State Diffusion‐Bonded Cu/α‐Al
2
O
3
Interfaces
. Journal of the American Ceramic Society 77:8, pages 2036-2042.
Crossref
Crossref
P.L. Ratnaparkhi & J.M. Howe. (1994) Structure and mechanism of bonding at a diffusion-bonded Al/SiC interface. Acta Metallurgica et Materialia 42:3, pages 811-823.
Crossref
Crossref
Yu.S. Kaganovskii & D.L. Beke. (1993) Kinetics of dissolution of beaded films into single crystal. Surface Science 298:1, pages 18-28.
Crossref
Crossref
J.C. Yang, Y.C. Lu & S.L. Saas. (1993) The influence of crystallography and oxide and metallic types on the structure and properties of metal-ceramic interfaces. Materials Science and Engineering: A 162:1-2, pages 97-106.
Crossref
Crossref
P. L. Ratnaparkhi. (2020) In situ hot-stage TEM study of a diffusion-bonded Al/SiC interface. Proceedings, annual meeting, Electron Microscopy Society of America 50:1, pages 218-219.
Crossref
Crossref
P.L. Ratnaparkhi & J.M. Howe. (1992) Amorphous phase formation by solid state reaction at a diffusion-bonded Al/SiC interface. Scripta Metallurgica et Materialia 27:2, pages 133-137.
Crossref
Crossref