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Original Articles

Properties of the liquid-vapour interface of fcc metals calculated using the tight-binding potential

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Pages 1067-1074 | Received 20 Jun 1996, Accepted 14 Aug 1996, Published online: 13 Sep 2006

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H.B. Liu, Z.Q. Hu & G.Y. An. (1999) Thermodynamic properties of Ni3Al and Cu3Au as calculated with the tight-binding potential. Philosophical Magazine B 79:7, pages 981-991.
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Articles from other publishers (5)

Saeed Zare Chavoshi & Shuozhi Xu. (2019) Nanoindentation/scratching at finite temperatures: Insights from atomistic-based modeling. Progress in Materials Science 100, pages 1-20.
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Cheng-Liang Liu, Te-Hua Fang & Jen-Fin Lin. (2007) Atomistic simulations of hard and soft films under nanoindentation. Materials Science and Engineering: A 452-453, pages 135-141.
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Hong-Ri Cong, Xiu-Fang Bian, Jing-Xiang Zhang & Hui Li. (2002) Structure properties of CuNi alloys at the rapid cooling rate using embedded-atom method. Materials Science and Engineering: A 326:2, pages 343-347.
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H.B Liu, J.A Ascencio, M Perez-Alvarez & M.J Yacaman. (2001) Melting behavior of nanometer sized gold isomers. Surface Science 491:1-2, pages 88-98.
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M. M. G. Alemany, O. Diéguez, C. Rey & L. J. Gallego. (1999) Molecular-dynamics study of the dynamic properties of fcc transition and simple metals in the liquid phase using the second-moment approximation to the tight-binding method. Physical Review B 60:13, pages 9208-9211.
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