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Heat Transfer Engineering Volume 29, 2008 - Issue 7
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feature articles

A Universal Performance Chart for CPU Cooling Devices

Kim Choon Ng Mechanical Engineering Department, National University of Singapore, Singapore
,
Christopher R. Yap Mechanical Engineering Department, National University of Singapore, Singapore
&
Mark Aaron Chan Mechanical Engineering Department, National University of Singapore, Singapore
Pages 651-656 | Published online: 14 Jul 2010

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Read on this site (2)

Wenxiu Zheng, Tiefeng Chen, Palash Sen & Bofeng Bai. (2023) Jet Impingement Boiling on Monocrystalline Silicon Surfaces with Open Microchannels. Heat Transfer Engineering 44:16-18, pages 1554-1562.
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Majid Molki & Abdul Mohi Mohammed. (2022) An Analytical-Computational Model for Predicting the Temperature of a Computer Central Processing Unit Cooler. Heat Transfer Engineering 43:14, pages 1241-1255.
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Articles from other publishers (8)

R. Kothari, S.K. Sahu, S.I. Kundalwal & S.P. Sahoo. (2021) Experimental investigation of the effect of inclination angle on the performance of phase change material based finned heat sink. Journal of Energy Storage 37, pages 102462.
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Anuj Kumar, Rohit Kothari, Santosh Kumar Sahu, Shailesh Ishwarlal Kundalwal & Maheandera Prabu Paulraj. (2021) Numerical investigation of cross plate fin heat sink integrated with phase change material for cooling application of portable electronic devices. International Journal of Energy Research 45:6, pages 8666-8683.
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Rohit Kothari, Santosh K. Sahu, Shailesh I. Kundalwal & Pawan Mahalkar. (2020) Thermal performance of phase change material–based heat sink for passive cooling of electronic components: An experimental study. International Journal of Energy Research 45:4, pages 5939-5963.
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Adeel Arshad, Hafiz Muhammad Ali, Wei-Mon Yan, Ahmed Kadhim Hussein & Majid Ahmadlouydarab. (2018) An experimental study of enhanced heat sinks for thermal management using n-eicosane as phase change material. Applied Thermal Engineering 132, pages 52-66.
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Maher Shaira & Suleiman Yousef. (2018) Modification of Aluminium 6063 Microstructure by Adding Boron and Titanium to Improve the Thermal Conductivity. Journal of Materials 2018, pages 1-6.
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Hafiz Muhammad Ali & Adeel Arshad. (2017) Experimental investigation of n-eicosane based circular pin-fin heat sinks for passive cooling of electronic devices. International Journal of Heat and Mass Transfer 112, pages 649-661.
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Adeel Arshad, Hafiz Muhammad Ali, Muzaffar Ali & Shehryar Manzoor. (2017) Thermal performance of phase change material (PCM) based pin-finned heat sinks for electronics devices: Effect of pin thickness and PCM volume fraction. Applied Thermal Engineering 112, pages 143-155.
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Rajesh Baby & C. Balaji. (2013) Thermal optimization of PCM based pin fin heat sinks: An experimental study. Applied Thermal Engineering 54:1, pages 65-77.
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