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feature articles

Research Regarding Heat Exchange Through Nanometric Polysynthetic Thermal Compound to Cooler–CPU Interface

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Pages 90-97 | Published online: 23 Jul 2010

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Read on this site (3)

Wenxiu Zheng, Tiefeng Chen, Palash Sen & Bofeng Bai. (2023) Jet Impingement Boiling on Monocrystalline Silicon Surfaces with Open Microchannels. Heat Transfer Engineering 44:16-18, pages 1554-1562.
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Majid Molki & Abdul Mohi Mohammed. (2022) An Analytical-Computational Model for Predicting the Temperature of a Computer Central Processing Unit Cooler. Heat Transfer Engineering 43:14, pages 1241-1255.
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Justin L. Smoyer & Pamela M. Norris. (2019) Brief Historical Perspective in Thermal Management and the Shift Toward Management at the Nanoscale. Heat Transfer Engineering 40:3-4, pages 269-282.
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