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Heat Transfer Engineering Volume 39, 2018 - Issue 4
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Articles

Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection

Abderrahmane BaïriLaboratoire Thermique Interfaces Environnement (LTIE-GTE), University of Paris,Ville d'Avray, FranceCorrespondence[email protected]
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,
Oriana HaddadLaboratoire Thermique Interfaces Environnement (LTIE-GTE), University of Paris,Ville d'Avray, FranceView further author information
,
Jean-Pascal GuinartLaboratoire Thermique Interfaces Environnement (LTIE-GTE), University of Paris,Ville d'Avray, FranceView further author information
,
Kemi AdeyeyeDepartment of Architecture and Civil Engineering, University of Bath,Bath, UKView further author information
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Nacim AlilatLaboratoire Thermique Interfaces Environnement (LTIE-GTE), University of Paris,Ville d'Avray, FranceView further author information
Pages 353-358 | Published online: 07 Jun 2017

Citations (2)

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Read on this site (1)

Cristina Mihaela Dragan & Dorin Lelea. (2022) Thermal Design Optimization of the Printed Circuit Board through Area Reduction. Heat Transfer Engineering 43:3-5, pages 248-256.
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Articles from other publishers (1)

Abderrahmane Baïri. (2017) Junction temperature of QFN32 and 64 electronic devices subjected to free convection. Effects of the resin's thermal conductivity. Microelectronics Reliability 74, pages 67-73.
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