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Journal of Adhesion Science and Technology Volume 28, 2014 - Issue 12
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Articles

Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects

K. SinhaDepartment of Mechanical Engineering, University of Maryland, College Park, MD20742, USACorrespondence[email protected]
,
D. FarleyDepartment of Mechanical Engineering, University of Maryland, College Park, MD20742, USA
,
T. KahnertDepartment of Mechanical Engineering, University of Maryland, College Park, MD20742, USA
,
S.D. SolaresDepartment of Mechanical Engineering, University of Maryland, College Park, MD20742, USA
,
A. DasguptaDepartment of Mechanical Engineering, University of Maryland, College Park, MD20742, USA
,
J.F.J. CaersPhilips Research, Electronic Packaging & Thin Film, High Tech Campus 7, WDX-3A 0.262, 5656 AEEindhoven, The Netherlands
&
X.J. ZhaoPhilips Research, Electronic Packaging & Thin Film, High Tech Campus 7, WDX-3A 0.262, 5656 AEEindhoven, The Netherlands
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Pages 1167-1191 | Received 22 Jun 2013, Accepted 01 Feb 2014, Published online: 12 Mar 2014

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Rui Ma, Mingyu Li, Lin Fang, Shaode Zhu & Ruisheng Zheng. (2016) Effect of the Ni/Pd/Au-Cu pre-plated finish lead frame surface structure treated by various surface roughening methods on packaging properties. Journal of Adhesion Science and Technology 30:4, pages 422-433.
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Articles from other publishers (1)

John W. Evans & Koustav Sinha. (2018) Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics. Microelectronics Reliability 80, pages 317-327.
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