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Journal of Adhesion Science and Technology Volume 29, 2015 - Issue 13
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Articles

Vacuum-based picking-up of thin chip from adhesive tape

Zhoulong XuState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, ChinaView further author information
,
Zunxu LiuState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, ChinaView further author information
,
YongAn HuangState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, ChinaCorrespondence[email protected]
View further author information
,
Jiankui ChenState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, ChinaView further author information
,
Huimin LiuState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, ChinaView further author information
&
Zhouping YinState Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan430074, ChinaCorrespondence[email protected]
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Pages 1315-1329 | Received 21 Aug 2014, Accepted 04 Mar 2015, Published online: 31 Mar 2015

Citations (13)

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Read on this site (1)

Jinhua Hong, Jiankui Chen, Zhoulong Xu & Zhouping Yin. (2018) Reliable thin chip peeling from adhesive tape with inverted needle ejecting and spring buffering. Journal of Adhesion Science and Technology 32:7, pages 753-771.
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Articles from other publishers (12)

Jinping Fu, Wei Du, Huiming Hou, Xiaohua Zhao & Tao Wu. (2023) Dynamic peeling process of IC chip from substrate based on a 3D analytical model. International Journal of Solids and Structures 279, pages 112374.
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ZhouPing Yin, YongAn Huang, Hua Yang, JianKui Chen, YongQing Duan & Wei Chen. (2022) Flexible electronics manufacturing technology and equipment. Science China Technological Sciences 65:9, pages 1940-1956.
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Tao Wu, Changhong Li, Weilin Ye, Fupei Wu & Bin Li. (2020) Linkage Control Policy on Area Pacesetter and Active Compensation for Chip Angle Correction. IEEE Transactions on Components, Packaging and Manufacturing Technology 10:9, pages 1524-1533.
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Tao Wu, Yuxian Lou, Fupei Wu & Bin Li. (2019) Study on Correction Method for Die Position Deviation Caused by Adhesive Tape Puncture. IEEE Transactions on Components, Packaging and Manufacturing Technology 9:7, pages 1388-1395.
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YongAn Huang, Zhouping Yin & Xiaodong WanYongAn Huang, Zhouping Yin & Xiaodong Wan. 2019. Modeling and Application of Flexible Electronics Packaging. Modeling and Application of Flexible Electronics Packaging 227 279 .
YongAn Huang, Zhouping Yin & Xiaodong WanYongAn Huang, Zhouping Yin & Xiaodong Wan. 2019. Modeling and Application of Flexible Electronics Packaging. Modeling and Application of Flexible Electronics Packaging 105 138 .
YongAn Huang, Zhouping Yin & Xiaodong WanYongAn Huang, Zhouping Yin & Xiaodong Wan. 2019. Modeling and Application of Flexible Electronics Packaging. Modeling and Application of Flexible Electronics Packaging 29 48 .
YongAn Huang, Zhouping Yin & Xiaodong WanYongAn Huang, Zhouping Yin & Xiaodong Wan. 2019. Modeling and Application of Flexible Electronics Packaging. Modeling and Application of Flexible Electronics Packaging 1 27 .
YongAn Huang, Huimin Liu, Zhoulong Xu, Jiankui Chen & Zhouping Yin. (2018) Conformal Peeling of Device-on-Substrate System in Flexible Electronic Assembly. IEEE Transactions on Components, Packaging and Manufacturing Technology 8:8, pages 1496-1506.
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Eun-Beom Jeon, Sung-Hyeon Park, Yun-Sik Yoo & Hak-Sung Kim. (2016) Analysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing Method. IEEE Transactions on Components, Packaging and Manufacturing Technology 6:11, pages 1696-1702.
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JianKui Chen, ZhouLong Xu, YongAn Huang, YongQing Duan & ZhouPing Yin. (2016) Analytical investigation on thermal-induced warpage behavior of ultrathin chip-on-flex (UTCOF) assembly. Science China Technological Sciences 59:11, pages 1646-1655.
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Zhoulong Xu, Zunxu Liu, Huimin Liu, Zhouping Yin, Yongan Huang & Jiankui Chen. (2015) Analytical Evaluation of Interfacial Crack Propagation in Vacuum-Based Picking-up Process. IEEE Transactions on Components, Packaging and Manufacturing Technology 5:11, pages 1700-1708.
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