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Journal of Dispersion Science and Technology Volume 21, 2000 - Issue 5
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Original Articles

CORRELATION OF DISPERSION STABILITY WITH SURFACTANT CONCENTRATION AND ABRASIVE PARTICLE SIZE FOR CHEMICAL MECHANICAL POLISHING (CMP) SLURRIES

B.J. Palla Center for Surface Science and Engineering Departments of Chemical Engineering and Anesthesiology, University of Florida, Gainesville, FL 32611, USA
&
D.O. Shah Center for Surface Science and Engineering Departments of Chemical Engineering and Anesthesiology, University of Florida, Gainesville, FL 32611, USA
Pages 491-509 | Received 31 Aug 1999, Accepted 30 Nov 1999, Published online: 03 Apr 2007

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Donggeon Kwak, Juhwan Kim & Taesung Kim. (2023) Evaluation of chemical mechanical planarization slurry dispersion using a combined scanning mobility particle sizer-optical particle sizer system. Aerosol Science and Technology 57:9, pages 833-841.
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Articles from other publishers (5)

Jarussri Chanwattanakit & Sumaeth Chavadej. (2018) Laundry Detergency of Solid Non-Particulate Soil Using Microemulsion-Based Formulation. Journal of Oleo Science 67:2, pages 187-198.
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F. Testa, C. Coetsier, E. Carretier, M. Ennahali, B. Laborie & P. Moulin. (2014) Recycling a slurry for reuse in chemical mechanical planarization of tungsten wafer: Effect of chemical adjustments and comparison between static and dynamic experiments. Microelectronic Engineering 113, pages 114-122.
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Sukbae Joo & Hong Liang. 2013. Tribology for Scientists and Engineers. Tribology for Scientists and Engineers 747 782 .
Naga Chandrasekaran. (2011) Material Removal Mechanisms of Oxide and Nitride CMP with Ceria and Silica-Based Slurries - Analysis of Slurry Particles Pre- and Post-Dielectric CMP. MRS Proceedings 816.
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Naga Chandrasekaran, Ted Taylor & Gundu Sabde. (2011) Effect of Ceria Particle-Size Distribution and Pressure Interactions in Chemo-Mechanical Polishing (CMP) of Dielectric Materials. MRS Proceedings 767.
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