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Materials Science and Technology Volume 34, 2018 - Issue 8
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Original Articles

Microstructure and reliability of Mo nanoparticle reinforced Sn–58Bi-based lead-free solder joints

Li YangSchool of Automotive Engineering, Changshu Institute of Technology, Jiangsu, People’s Republic of China;School of Mechanical and Electrical Engineering, Soochow University, Jiangsu, People’s Republic of ChinaCorrespondence[email protected]
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,
Lu ZhuSchool of Automotive Engineering, Changshu Institute of Technology, Jiangsu, People’s Republic of China;School of Mechanical and Electrical Engineering, Soochow University, Jiangsu, People’s Republic of ChinaView further author information
,
Yaocheng ZhangSchool of Automotive Engineering, Changshu Institute of Technology, Jiangsu, People’s Republic of ChinaView further author information
,
Po LiuSchool of Automotive Engineering, Changshu Institute of Technology, Jiangsu, People’s Republic of ChinaView further author information
,
Ning ZhangJiangsu Key Laboratory of Large Engineering Equipment Detection and Control, Xuzhou Institute of Technology, Jiangsu, People’s Republic of ChinaView further author information
,
Shiyuan ZhouSchool of Automotive Engineering, Changshu Institute of Technology, Jiangsu, People’s Republic of China;School of Mechanical and Electrical Engineering, Soochow University, Jiangsu, People’s Republic of ChinaView further author information
&
Licheng JiangSchool of Automotive Engineering, Changshu Institute of Technology, Jiangsu, People’s Republic of ChinaView further author information
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Pages 992-1002 | Received 31 Aug 2017, Accepted 05 Dec 2017, Published online: 20 Dec 2017

Citations (14)

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Shuang Zhang, Yang Liu, Hao Zhang, Min Zhou, Yuxiong Xue, Xianghua Zeng, Rongxing Cao & Penghui Chen. (2021) Effects of Sn-Ag-x layers on the solderability and mechanical properties of Sn-58Bi solder. Welding International 35:1-3, pages 16-23.
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Articles from other publishers (13)

Chih-han Yang, Yu-chen Liu, Hiroshi Nishikawa & Shih-kang Lin. (2024) Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders. Journal of Materials Research and Technology 30, pages 16-24.
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Linmei Yang, Shiran Ma, Guowan Mu & Te Huang. (2023) Effect of Ag nanoparticles on microstructure evolution, hardness, and bismuth segregation of SnBi/Cu joint. Journal of Materials Science: Materials in Electronics 34:30.
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Ziwen Lv, Jintao Wang, Fengyi Wang, Weiwei Zhang, Jianqiang Wang, Fuquan Li & Hongtao Chen. (2023) In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by Cu6Sn5 nanoparticles. Journal of Materials Science: Materials in Electronics 34:19.
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Chih-Han Yang, Yu-Chen Liu, Yuki Hirata, Hiroshi Nishikawa & Shih-Kang Lin. (2022) Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders. Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders.
Amares Singh, Rajkumar Durairaj, K Ganesh Kumar & Seng How Kuan. (2022) Impact of 3% Molybdenum(Mo) nanoparticles on the interfacial and shear properties of lead-free Sn58Bi/Cu solder joint. IOP Conference Series: Materials Science and Engineering 1225:1, pages 012029.
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Zhen Li, Guanzhi Wu, Kai Ding & Yulai Gao. 2022. TMS 2022 151st Annual Meeting & Exhibition Supplemental Proceedings. TMS 2022 151st Annual Meeting & Exhibition Supplemental Proceedings 1079 1087 .
Dania Bani Hani, Raed Al Athamneh, Mohammed Aljarrah & Sa’d Hamasha. (2021) Shear Strength Degradation Modeling of Lead-Free Solder Joints at Different Isothermal Aging Conditions. Journal of Microelectronics and Electronic Packaging 18:3, pages 137-144.
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Sri Harini Rajendran, Hyejun Kang & Jae Pil Jung. (2021) Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties. Journal of Materials Engineering and Performance 30:5, pages 3167-3172.
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Hyejun Kang, Sri Harini Rajendran & Jae Pil Jung. (2021) Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics. Metals 11:2, pages 364.
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Raed Al Athamneh, Dania Bani Hani, Haneen Ali & Sa'D Hamasha. (2020) Fatigue Life Degradation Modeling of SnAgCu Solder Joints After Aging. IEEE Transactions on Components, Packaging and Manufacturing Technology 10:7, pages 1175-1184.
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Feifei Tian, Xueyong Pang, Bo Xu & Zhi-Quan Liu. (2020) Evolution and Growth Mechanism of Cu2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging. Journal of Electronic Materials 49:4, pages 2651-2659.
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Li Yang, Lu Zhu, Yaocheng Zhang, Shiyuan Zhou, Guoqiang Wang, Sai Shen & Xiaolong Shi. (2019) Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling. Materials Characterization 148, pages 280-291.
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Fengjiang Wang, Hong Chen, Ying Huang, Luting Liu & Zhijie Zhang. (2019) Recent progress on the development of Sn–Bi based low-temperature Pb-free solders. Journal of Materials Science: Materials in Electronics 30:4, pages 3222-3243.
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