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Original Articles

Monte Carlo Simulation of Thin Film Growth with Defect Formation: Application to Via Filling

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Pages 895-899 | Received 01 Jan 2004, Accepted 01 Feb 2004, Published online: 17 Jul 2006

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Y. Kaneko, Y. Hiwatari, K. Ohara & F. Asa. (2006) Monte Carlo simulation of damascene electroplating: effects of additives. Molecular Simulation 32:15, pages 1227-1232.
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Articles from other publishers (3)

Antti Pohjoranta & Robert Tenno. (2014) Microvia fill process model and control. Journal of Mathematical Chemistry 52:5, pages 1414-1440.
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Yutaka Kaneko. 2014. Copper Electrodeposition for Nanofabrication of Electronics Devices. Copper Electrodeposition for Nanofabrication of Electronics Devices 63 95 .
Yutaka Kaneko, Yasuaki Hiwatari, Katsuhiko Ohara & Fujio Asa. (2013) Kinetic Monte Carlo simulation of three-dimensional shape evolution with void formation using Solid-by-Solid model: Application to via and trench filling. Electrochimica Acta 100, pages 321-328.
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