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Philosophical Magazine Letters Volume 83, 2003 - Issue 8
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Original Articles

Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films

G. P. Zhang Max-Planck-Institut für Metallforschung, Heisenbergstrasse 3, Stuttgart, D-70569, Germany; Shenyang National Laboratory for Materials Science, Institute of Metal Research Chinese Academy of Sciences, 72 Wenhua Road, Shenyang, 110016, PR China
,
R. Schwaiger Max-Planck-Institut für Metallforschung, Heisenbergstrasse 3, Stuttgart, D-70569, Germany
,
C. A. Volkert Max-Planck-Institut für Metallforschung, Heisenbergstrasse 3, Stuttgart, D-70569, Germany; Forschungszentrum Karlsruhe, Institut für Materialforschung II, Postfach 3640, Karlsruhe, D-76021, Germany
&
O. Kraft Forschungszentrum Karlsruhe, Institut für Materialforschung II, Postfach 3640, Karlsruhe, D-76021, Germany
Pages 477-483 | Published online: 14 Nov 2010

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Xingzhen Huang & Zhaoxia Li. (2022) A multi-scale model of film/substrate interface damage due to the evolution of vacancy concentration inside the film. Mechanics of Advanced Materials and Structures 0:0, pages 1-11.
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X. L. Guo, L. Lu & S. X. Li. (2005) Dislocation evolution in twins of cyclically deformed copper. Philosophical Magazine Letters 85:12, pages 613-623.
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