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Welding International Volume 21, 2007 - Issue 12
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Original Articles

Bonding process of Al/Cu dissimilar bonding with liquefaction in air

H. Kawakami Member, Graduate School of Engineering, Mie University
,
J. Suzuki Student Member, GraduateSchool of Engineering, Mie University
&
J. Nakajima Student Member, GraduateSchool of Engineering, Mie University
Pages 836-843 | Published online: 14 Aug 2008

Citations (9)

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Read on this site (1)

X. G. Wang, F. J. Yan, X. G. Li & C. G. Wang. (2017) Induction diffusion brazing of copper to aluminium. Science and Technology of Welding and Joining 22:2, pages 170-175.
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Articles from other publishers (8)

Hamza ESSOUSSI & Said ETTAQI. (2021) On the mechanical properties of Al/Cu-grid/Al intermetallic composite. Journal of Metals, Materials and Minerals 31:1.
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Qiang Feng, Shengshou Ma, Changzhong Liao, Yuhuan Xie & Zhiwei Duan. (2020) Effects of CuSn 33 content on the microstructure and mechanical properties of Al/Cu bimetallic foams . Materials Research Express 8:1, pages 016504.
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Xue-Gang Wang, Xin-Geng Li & Cheng-Guo Wang. (2018) Influence of diffusion brazing parameters on microstructure and properties of Cu/Al joints. Journal of Manufacturing Processes 35, pages 343-350.
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Qinghua Chang, Jingpei Xie, Aixia Mao & Wenyan Wang. (2018) Study on Interface Structure of Cu/Al Clad Plates by Roll Casting. Metals 8:10, pages 770.
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Yan-qiu Han, Li-hua Ben, Jin-jin Yao, Shu-wei Feng & Chun-jing Wu. (2015) Investigation on the interface of Cu/Al couples during isothermal heating. International Journal of Minerals, Metallurgy, and Materials 22:3, pages 309-318.
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Yan-qiu Han, Li-hua Ben, Jin-jin Yao & Chun-jing Wu. (2015) Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region. International Journal of Minerals, Metallurgy, and Materials 22:1, pages 94-101.
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Yan Qiu Han, Li Hua Ben, Jin Jin Yao, Shu Wei Feng & Chun Jing Wu. (2014) Influence of the Bonding Temperature on the Microstructure at the Cu/Al Interfacial Region. Applied Mechanics and Materials 644-650, pages 4909-4913.
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Hiroshi Kawakami, Toshiharu Kawabe & Jippei Suzuki. (2010) Action of Displacement Control on Vacuum Free Aluminum/Copper Diffusion Liquefaction Bonding. Materials Science Forum 638-642, pages 3297-3301.
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