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Welding International Volume 10, 1996 - Issue 9
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Behaviour of oxide at diffusion‐bonded interfaces in Al‐Mg‐Si series 6063 alloy: Study of diffusion‐bonding mechanism of aluminium alloys by transmission electron microscopy (1st Report)

K Ikeuchi Welding Research Institute, Osaka University,
,
F Matsuda Welding Research Institute, Osaka University,
&
K Kotani Industrial Research Institute of Aichi Prefecture,
Pages 697-704 | Published online: 09 Dec 2009

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