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Dongping Chen, Xuening Chu, Xiwu Sun & Yupeng Li. (2015) A new product service system concept evaluation approach based on Information Axiom in a fuzzy-stochastic environment. International Journal of Computer Integrated Manufacturing 28:11, pages 1123-1141.
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G.D. Li, S. Masuda & M. Nagai. (2015) Predictor design using an improved grey model in control systems. International Journal of Computer Integrated Manufacturing 28:3, pages 297-306.
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Md. Abdul Alim, M.Z. Abdullah, M.S. Abdul Aziz & R. Kamarudin. (2021) Die attachment, wire bonding, and encapsulation process in LED packaging: A review. Sensors and Actuators A: Physical 329, pages 112817.
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Wuwei Feng, Xin Chen, Cuizhu Wang & Yuzhou Shi. (2021) Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding. International Journal of Distributed Sensor Networks 17:5, pages 155014772110183.
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Falin Wang, Zhinong Li, Xuepeng Guo & Wenhe Liao. (2020) Quality prediction and control of cable harness wiring using extension theory and a backpropagation neural network. Advances in Mechanical Engineering 12:5, pages 168781402092310.
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Yun-Chia Chen, Chen-Fu Chien, Yi-Yu Chen & Chun-Yao Wang. (2019) A Data Mining Approach for Optimizing Manufacturing Parameters of Wire Bonding Process in IC Packaging Industry and Empirical Study. A Data Mining Approach for Optimizing Manufacturing Parameters of Wire Bonding Process in IC Packaging Industry and Empirical Study.
Jinn-Tsong Tsai, Cheng-Chung Chang, Wen-Ping Chen & Jyh-Horng Chou. (2016) Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method. IEEE Access 4, pages 3034-3045.
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Fuliang Wang, Junhui Li, Shaohua Liu & Lei Han. (2014) Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and an Artificial Neural Network. IEEE Transactions on Semiconductor Manufacturing 27:2, pages 232-237.
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Zaliman Sauli, Vithyacharan Retnasamy, Aaron Koay Terr Yeow, Goh Siew Chui, K. Anwar & Nooraihan Abdullah. (2014) Surface Roughness and Wettability Correlation on Etched Platinum Using Reactive Ion Ecthing. Applied Mechanics and Materials 487, pages 263-266.
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