Determination of creep behaviour of Ti60 alloy by small punch creep test

Hui LiuCollege of Information, Mechanical and Electronic Engineering, Shanghai Normal University, Shanghai, P.R. ChinaCorrespondence[email protected]

Wenjie LinCollege of Information, Mechanical and Electronic Engineering, Shanghai Normal University, Shanghai, P.R. China

Jiarui DouCollege of Information, Mechanical and Electronic Engineering, Shanghai Normal University, Shanghai, P.R. China

Citations (0)

Keep up to date with the latest research on this topic with citation updates for this article.

Articles from other publishers (2)

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Order Reprints Request Corporate Permissions

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

Request Academic Permissions

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.

Determination of creep behaviour of Ti60 alloy by small punch creep test

Articles from other publishers (2)

Information for

Open access

Opportunities

Help and information

Your download is now in progress and you may close this window

Login or register to access this feature

Determination of creep behaviour of Ti60 alloy by small punch creep test

Citations (0)

Articles from other publishers (2)

Reprints and Corporate Permissions

Academic Permissions

Related research

To cite this article:

Download citation

Information for

Open access

Opportunities

Help and information

Keep up to date