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Tribology Transactions Volume 57, 2014 - Issue 2
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Original Articles

Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical–Mechanical Polishing

Tae-Young Kwon Department of Materials Engineering, Hanyang University, Ansan, 426-791, Korea
,
Byoung-Jun Cho Bio-Nano Technology, Hanyang University, Ansan, 426-791, Korea
,
R. Prasanna Venktesh Department of Materials Engineering, Hanyang University, Ansan, 426-791, Korea
,
Manivannan Ramachandran Department of Materials Engineering, Hanyang University, Ansan, 426-791, Korea
,
Hyuk-Min Kim Bio-Nano Technology, Hanyang University, Ansan, 426-791, Korea
,
Chang-Ki Hong Cheil Industries, Uiwang, 437-711, Korea
&
Jin-Goo Park Department of Materials Engineering, Hanyang University, Ansan, 426-791, Korea; Bio-Nano Technology, Hanyang University, Ansan, 426-791, Korea
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Pages 190-197 | Received 16 Apr 2013, Accepted 26 Oct 2013, Published online: 10 Mar 2014

Citations (3)

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Huaping Xiao, Shuhai Liu, Yanbao Guo, Deguo Wang & Yu Chen. (2016) Effects of Microscale Particles as Antiwear Additives in Water-Based Slurries with Abrasives. Tribology Transactions 59:2, pages 323-329.
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Articles from other publishers (2)

Qixiang Zhang, Jisheng Pan, Xiaowei Zhang, Jiabin Lu & Qiusheng Yan. (2021) Tribological behavior of 6H–SiC wafers in different chemical mechanical polishing slurries. Wear 472-473, pages 203649.
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T. B. Zubi, R. A. Wiencek, A. L. Mlynarski, J. M. Truffa, K. M. Wortman-Otto, C. Saucedo, M. G. Salinas, C. F. Graverson & J. J. Keleher. (2019) Unraveling Slurry Chemistry/Nanoparticle/Polymeric Membrane Adsorption Relevant to Cu Chemical Mechanical Planarization (CMP) Filtration Applications. ECS Journal of Solid State Science and Technology 8:5, pages P3022-P3027.
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