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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 70, 2016 - Issue 7
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Original Articles

On the junction temperature of the QFN64 electronic package subjected to free convection: Effects of the encapsulating molding compound

A. BaïriLaboratoire Thermique Interfaces Environnement, University of Paris, Ville d’Avray, FranceCorrespondence[email protected]
Pages 809-814 | Received 29 Feb 2016, Accepted 21 Jun 2016, Published online: 20 Sep 2016

Citations (5)

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Read on this site (1)

Abderrahmane Baïri, Oriana Haddad, Jean-Pascal Guinart, Kemi Adeyeye & Nacim Alilat. (2018) Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection. Heat Transfer Engineering 39:4, pages 353-358.
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Articles from other publishers (4)

Abderrahmane BaïriBruno Chanetz & J. A. Millán-García. (2017) Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection: Influence of the Adhesive Paste on the Junction Temperature. Journal of Electronic Packaging 139:4.
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A. Baïri, L. Roseiro, J.A. Millán-García, I. Gómez-Arriaran & M. Odriozola-Maritorena. (2017) Energy management in smart building with wire-bonded QFN64b electronic package subjected to air free convection. Experimental and numerical study. Energy and Buildings 149, pages 321-328.
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Abderrahmane Baïri. (2017) Junction temperature of QFN32 and 64 electronic devices subjected to free convection. Effects of the resin's thermal conductivity. Microelectronics Reliability 74, pages 67-73.
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A. Baïri, N. Nithyadevi, I. Baïri, A. Martin-Garín & J.A. Millán-García. (2017) Thermal design of a sensor for building control equipped with QFN electronic devices subjected to free convection. Effects of the encapsulating resin. Energy and Buildings 141, pages 218-225.
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