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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 26, 1994 - Issue 1
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Original Articles

PREDICTION OF TURBULENT THREE-DIMENSIONAL HEAT TRANSFER OF HEATED BLOCKS USING LOW-REYNOLDS NUMBER TWO-EQUATION MODEL

Mohammad Faghri Department of Mechanical Engineering, University of Rhode Island, Kingston, Rhode Island, USA
&
Y. Asako Department of Mechanical Engineering, Tokyo Metropolitan University, Tokyo, Japan
Pages 87-101 | Received 13 May 1993, Accepted 09 Jul 1993, Published online: 27 Apr 2007

Citations (8)

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Read on this site (2)

Li-Zhi Zhang. (2007) Thermally Developing Forced Convection and Heat Transfer in Rectangular Plate-Fin Passages Under Uniform Plate Temperature. Numerical Heat Transfer, Part A: Applications 52:6, pages 549-564.
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Y. Asako & Mohammad Faghri. (1995) PREDICTION OF TURBULENT HEAT TRANSFER IN THE ENTRANCE OF AN ARRAY OF HEATED BLOCKS USING LOW-REYNOLDS-NUMBER κ-ε MODEL. Numerical Heat Transfer, Part A: Applications 28:3, pages 263-277.
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Articles from other publishers (6)

Bengt Sundén & Gongnan Xie. (2014) Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink. Journal of Electronic Packaging 136:2.
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Gorka S. Larraona, Alejandro Rivas, Raúl Antón, Juan Carlos Ramos, Ignacio Pastor & Bahram Moshfegh. (2013) Computational parametric study of an impinging jet in a cross-flow configuration for electronics cooling applications. Applied Thermal Engineering 52:2, pages 428-438.
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G Hetsroni, C.-F Li, A Mosyak & I Tiselj. (2001) Heat transfer and thermal pattern around a sphere in a turbulent boundary layer. International Journal of Multiphase Flow 27:7, pages 1127-1150.
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Y. Asako, Y. Yamaguchi & M. Faghri. (1999) Numerical and Experimental Prediction of Transitional Characteristics of Flow and Heat Transfer in an Array of Heated Blocks. Journal of Electronic Packaging 121:3, pages 202-208.
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E.R.G. Eckert, R.J. Goldstein, W.E. Ibele, S.V. Patankar, T.W. Simon, P.J. Strykowski, K.K. Tamma, T.H. Kuehn, A. Bar-Cohen, J.V.R. Heberlein, D.L. Hofeldt, J.H. Davidson, J. Bischof & F. Kulacki. (1997) Heat transfer—a review of 1994 literature. International Journal of Heat and Mass Transfer 40:16, pages 3729-3804.
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P.G. Tucker. (1997) CFD applied to electronic systems: a review. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 20:4, pages 518-529.
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