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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 29, 1996 - Issue 1
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Original Articles

CONJUGATE NATURAL CONVECTION FROM AN ARRAY OF PROTRUDING HEAT SOURCES

T. J. Heindel Heat Transfer Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, Indiana, 47907-1288, USA
,
S. Ramadhyani Heat Transfer Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, Indiana, 47907-1288, USA
&
F. P. Incropera Heat Transfer Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, Indiana, 47907-1288, USA
Pages 1-18 | Received 16 Feb 1995, Accepted 14 Jul 1995, Published online: 02 Apr 2007

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Shankar Durgam, Shakkottai P. Venkateshan & Thirumalachari Sundararajan. (2020) Effect of Thermal Conductivity on Cooling of Square Heat Source Array under Natural Convection in a Vertical Channel. Heat Transfer Engineering 41:11, pages 947-960.
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M. A. Habib, S. A. M. Said & T. Ayinde. (2014) Characteristics of Natural Convection Heat Transfer in an Array of Discrete Heat Sources. Experimental Heat Transfer 27:1, pages 91-111.
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AlexandreK. da Silva & Louis Gosselin. (2010) Numerical Modeling of Free-Convection in Sinuous Channels with Leveled and Unleveled Ports. Numerical Heat Transfer, Part A: Applications 57:2, pages 101-118.
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Nader Ben Cheikh, AliJ. Chamkha & Brahim Ben Beya. (2009) Effect of Inclination on Heat Transfer and Fluid Flow in a Finned Enclosure Filled with a Dielectric Liquid. Numerical Heat Transfer, Part A: Applications 56:3, pages 286-300.
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Yong Zeng & Kambiz Vafai. (2009) An Investigation of Convective Cooling of an Array of Channel-Mounted Obstacles. Numerical Heat Transfer, Part A: Applications 55:11, pages 967-982.
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Qihong Nie & Yogendra Joshi. (2007) Multiscale Thermal Modeling Methodology for Thermoelectrically Cooled Electronic Cabinets. Numerical Heat Transfer, Part A: Applications 53:3, pages 225-248.
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B. Ghasemi. (2005) MIXED CONVECTION IN A RECTANGULAR CAVITY WITH A PULSATING HEATED ELECTRONIC COMPONENT. Numerical Heat Transfer, Part A: Applications 47:5, pages 505-521.
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Shu-Hao Chuang, Jiunn-Shean Chiang & Yuan-Ming Kuo. (2003) Numerical Simulation of Heat Transfer in a Three-Dimensional Enclosure with Three Chips in Various Position Arrangements. Heat Transfer Engineering 24:2, pages 42-59.
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Yang Liu, Nhan Phan-Thien, Ronald Kemp & Xiao-Lin Luo. (1997) THREE-DIMENSIONAL COUPLED CONDUCTION-CONVECTION PROBLEM FOR THREE CHIPS MOUNTED ON A SUBSTRATE IN AN ENCLOSURE. Numerical Heat Transfer, Part A: Applications 32:2, pages 149-167.
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Articles from other publishers (17)

Z. Cai & B. Thornber. (2018) An internal penalty discontinuous Galerkin method for simulating conjugate heat transfer in a closed cavity. International Journal for Numerical Methods in Fluids 87:3, pages 134-159.
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V. Kazemi-Kamyab, A.H. van Zuijlen & H. Bijl. (2014) Analysis and application of high order implicit Runge–Kutta schemes for unsteady conjugate heat transfer: A strongly-coupled approach. Journal of Computational Physics 272, pages 471-486.
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V. Kazemi-Kamyab, A.H. van Zuijlen & H. Bijl. (2013) A high order time-accurate loosely-coupled solution algorithm for unsteady conjugate heat transfer problems. Computer Methods in Applied Mechanics and Engineering 264, pages 205-217.
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R. Ben-Mansour & M. A. Habib. (2015) Use of Nanofluids for Improved Natural Cooling of Discretely Heated Cavities. Advances in Mechanical Engineering 5, pages 383267.
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Alexandre K. da Silva & Louis Gosselin. (2010) Volumetric maximization of coolant usage in closed self-driven circuits. International Journal of Heat and Mass Transfer 53:19-20, pages 3969-3976.
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Esam M. Alawadhi. (2008) Natural Convection Flow in a Cubical Enclosure with a Heated Strip. Journal of Thermophysics and Heat Transfer 22:3, pages 515-521.
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Qihong Nie & Y. Joshi. (2006) Multi-scale Thermal Modeling Methodology for Electronics Cabinets. Multi-scale Thermal Modeling Methodology for Electronics Cabinets.
Lan Tang & Yogendra K. Joshi. (2005) A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating. Journal of Heat Transfer 127:1, pages 18-26.
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B.S. Yilbas, S.Z. Shuja & M.O. Iqbal. (2002) Energy and entropy analysis in a square cavity with protruding body: effects of protruding body aspect ratio. International Journal of Energy Research 26:9, pages 851-866.
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Ramón L Frederick & Fernando Quiroz. (2001) On the transition from conduction to convection regime in a cubical enclosure with a partially heated wall. International Journal of Heat and Mass Transfer 44:9, pages 1699-1709.
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S.Z. Shuja, B.S. Yilbas & M.O. Iqbal. (2000) Mixed convection in a square cavity due to heat generating rectangular body. International Journal of Numerical Methods for Heat & Fluid Flow 10:8, pages 824-841.
Crossref
P.N. Madhavan & V.M.K. Sastri. (2000) Conjugate natural convection cooling of protruding heat sources mounted on a substrate placed inside an enclosure: a parametric study. Computer Methods in Applied Mechanics and Engineering 188:1-3, pages 187-202.
Crossref
YANG LIU, CHUN WAH LEUNG, TAL LEUNG CHANG & PHAN-THUEN NHAN. (2000) AN OPTIMUM SPACING PROBLEM FOR FIVE CHIPS ON A HORIZONTAL SUBSTRATE IN AN ENCLOSURE – NATURAL CONVECTION. International Journal of Computational Engineering Science 01:01, pages 167-186.
Crossref
E.R.G. Eckert, R.J. Goldstein, W.E. Ibele, T.W. Simon, T.H. Kuehn, P.J. Strykowski, K.K. Tamma, A. Bar-Cohen, J.V.R. Heberlein, J.H. Davidson, J. Bischof, F. Kulacki & U. Kortshagen. (2000) Heat transfer — a review of 1996 literature. International Journal of Heat and Mass Transfer 43:8, pages 1273-1371.
Crossref
K.K. Sikka, K.E. Torrance & T.S. Fisher. (1999) Experiments on low velocity cooling of high conductivity substrates. IEEE Transactions on Components and Packaging Technologies 22:2, pages 307-315.
Crossref
Muhammad M. Rahman & Jagannath Raghavan. (1999) Transient response of protruding electronic modules exposed to horizontal cross flow. International Journal of Heat and Fluid Flow 20:1, pages 48-59.
Crossref
P.G. Tucker. (1997) CFD applied to electronic systems: a review. IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 20:4, pages 518-529.
Crossref

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