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Critical Reviews in Solid State and Materials Sciences Volume 41, 2016 - Issue 2
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Understanding the Growth of Interfacial Reaction Product Layers between Dissimilar Materials

Tomi LaurilaDepartment of Electrical Engineering and Automation, School of Electrical Engineering, Aalto University, Espoo, FinlandCorrespondence[email protected]
&
Aloke PaulDepartment of Materials Engineering, Indian Institute of Science, Bangalore, India
Pages 73-105 | Published online: 09 Oct 2015

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Varun A. Baheti, Sarfaraj Islam, Praveen Kumar, Raju Ravi, Ramesh Narayanan, Dong Hongqun, Vesa Vuorinen, Tomi Laurila & Aloke Paul. (2016) Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system. Philosophical Magazine 96:1, pages 15-30.
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Articles from other publishers (5)

Han Liu, Ying Chen, Zhaohe Gao, Nadia Rohbeck & Ping Xiao. (2023) A study of reaction between palladium, palladium silver alloy and silicon carbide ceramics at high temperature. Journal of the European Ceramic Society 43:8, pages 3077-3089.
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C. Wieser, W. Hügel, S. Martin, J. Freudenberger & A. Leineweber. (2020) Stabilization of the ζ-Cu10Sn3 Phase by Ni at Soldering-Relevant Temperatures. Journal of Electronic Materials 49:6, pages 3609-3623.
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Ee Lynn Lee, Yingxin Goh & A. S. M. A. Haseeb. (2020) Growth and mechanical properties of intermetallic compound between solid cobalt and molten tin. Journal of Materials Science: Materials in Electronics 31:6, pages 4554-4562.
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S. Santra, T. Davies, G. Matthews, J. Liu, C.R.M. Grovenor & S.C. Speller. (2019) The effect of the size of NbTi filaments on interfacial reactions and the properties of InSn-based superconducting solder joints. Materials & Design 176, pages 107836.
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Xianyu Meng, Liangshun Luo, Nana Guo, Mingxing Shi, Fuxin Wang, Yanjin Xu, Yanqing Su & Jingjie Guo. (2018) Thermodynamic analysis of the interactions between Nb–Si alloy and molding material. Materials Research Express 5:1, pages 016513.
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