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Materials and Manufacturing Processes Volume 26, 2011 - Issue 8
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Original Articles

Comparing Atomistic Machining of Monocrystalline and Polycrystalline Copper Structures

Jing Shi Department of Industrial and Manufacturing Engineering, North Dakota State University, Fargo, North Dakota, USACorrespondence[email protected]
&
Mayank Verma Department of Industrial and Manufacturing Engineering, North Dakota State University, Fargo, North Dakota, USA
Pages 1004-1010 | Received 31 May 2010, Accepted 07 Aug 2010, Published online: 03 Aug 2011

Citations (18)

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Read on this site (2)

Yusuf Özçatalbaş. (2014) Machinability of Elongated Coarse Grain Fe-Based Superalloys. Machining Science and Technology 18:4, pages 626-637.
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L.H. R. Machado, M.A. Câmara & A.M. Abrão. (2014) The Performance of Tungsten Carbide and High Speed Steel When Drilling Nickel–Copper. Materials and Manufacturing Processes 29:3, pages 379-385.
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Articles from other publishers (16)

Prabhat Ranjan, Ayush Owhal, Digvijay Chakrabarti, Sachin U. Belgamwar, Tribeni Roy & R. Balasubramaniam. (2022) Fundamental insights of mechanical polishing on polycrystalline Cu through molecular dynamics simulations. Materials Today Communications 32, pages 103980.
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Zhemin Shi, Beizhi Li & Zhihong Sun. (2022) Study on microstructure evolution of grinding surface of bcc Fe-Ni maraging steel based on molecular dynamics. Applied Surface Science 573, pages 151493.
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CHUNHUI JI, SHUANGQIU SUN, BIN LIN & TIANYI SUI. (2019) EVALUATION OF SURFACE ROUGHNESS PRODUCED BY NANOCUTTING COPPER STRUCTURE USING A LEAST SQUARE MEAN METHOD. Surface Review and Letters 27:01, pages 1950081.
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Yachao Wang & Jing Shi. (2019) Phase transformation of monocrystalline silicon by nanoindentation – Effect of processing temperature. Materials Science in Semiconductor Processing 102, pages 104601.
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Yixin Xu, Fulong Zhu, Miaocao Wang, Xiaojian Liu & Sheng Liu. (2018) Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO<inf>2</inf> Composite Structures. Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO<inf>2</inf> Composite Structures.
Yao Liu, Beizhi Li & Lingfei Kong. (2018) A molecular dynamics investigation into nanoscale scratching mechanism of polycrystalline silicon carbide. Computational Materials Science 148, pages 76-86.
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Dehao Liu, Gang Wang, Jianchao Yu & Yiming (Kevin) Rong. (2017) Molecular dynamics simulation on formation mechanism of grain boundary steps in micro-cutting of polycrystalline copper. Computational Materials Science 126, pages 418-425.
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Chi-Hui Chien, Chung-Ting Wang, Cing-Han Tsai, Ping-Feng Yang, Ying-Xu Lu & Bo-Syun Chen. (2016) Temperature effect on kinetic friction characteristics of Cu substrate composed by single crystal and polycrystalline structures. Computational Materials Science 117, pages 412-421.
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Jing Jing Chen, Jian Meng Huang, Yang Liu, Sheng Fu Gao & Ning Li. (2015) The Influence of Velocity Variation on the Adhesive Contact Behavior and the Deformation of Substrate Based on Molecular Dynamics Method. Key Engineering Materials 642, pages 141-146.
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Jing Shi, Chunhui Ji, Yachao Wang & Steve Hsueh-Ming Wang. (2014) Tool/Chip Interfacial Friction Analysis in Atomistic Machining of Polycrystalline Coppers. Journal of Micro and Nano-Manufacturing 2:4.
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Xiao Guang Guo, Chang Heng Zhai, Zi Yuan Liu, Liang Zhang, Zhu Ji Jin & Ren Ke Kang. (2014) Research on Elastic-Plastic Transition and Hardening Effect for Monocrystalline Silicon Surfaces. Advanced Materials Research 1027, pages 101-106.
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Jing Shi, Yachao Wang & Xiaoping Yang. (2013) Nano-scale machining of polycrystalline coppers - effects of grain size and machining parameters. Nanoscale Research Letters 8:1.
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Yachao Wang & Jing Shi. (2013) Effects of water molecules on tribological behavior and property measurements in nano-indentation processes - a numerical analysis. Nanoscale Research Letters 8:1.
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Chunhui Ji, Jing Shi, Zhanqiang Liu & Yachao Wang. (2013) Comparison of tool–chip stress distributions in nano-machining of monocrystalline silicon and copper. International Journal of Mechanical Sciences 77, pages 30-39.
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Chunhui Ji, Jing Shi, Yachao Wang & Zhanqiang Liu. (2013) A numeric investigation of friction behaviors along tool/chip interface in nanometric machining of a single crystal copper structure. The International Journal of Advanced Manufacturing Technology 68:1-4, pages 365-374.
Crossref
Dr. Prabhat Ranjan, Mr. Ayush Owhal, Digvijay Chakrabarti, Dr. Sachin Belgamwar, T Roy & Dr. R. Balasubramaniam. (2022) Fundamental Insights of Mechanical Polishing on Polycrystalline Cu Through Molecular Dynamics Simulations. SSRN Electronic Journal.
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