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Materials and Manufacturing Processes Volume 30, 2015 - Issue 2
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Original Articles

Dissolution of Copper and Formation of IMC in Bulk Lead-Free Solders

Mohammad FaizanDepartment of Mechanical Engineering, Taif University, Taif, Kingdom of Saudi ArabiaCorrespondence[email protected]
Pages 169-174 | Received 28 Jan 2014, Accepted 08 Jun 2014, Published online: 22 Dec 2014

Citations (5)

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Karan Pawar, Harsha S & Pradeep Dixit. (2023) Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging. Materials and Manufacturing Processes 38:3, pages 284-294.
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Articles from other publishers (4)

Jing Rou Lee, Mohd Sharizal Abdul Aziz, Mohammad Hafifi Hafiz Ishak & Chu Yee Khor. (2022) A review on numerical approach of reflow soldering process for copper pillar technology. The International Journal of Advanced Manufacturing Technology 121:7-8, pages 4325-4353.
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Xuemin Sun, Weiyuan Yu, Baolei Wu & Guoqing Yang. (2020) Kinetics of Dissolution of Copper in Liquid Tin With Ultrasonic Waves. Materials Research 23:1.
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M. B. Zhou, X. F. Zhao, W. Yue & X. P. Zhang. (2019) Unique interfacial reaction and so-induced change in mechanical performance of Sn–3.0Ag–0.5Cu/Cu solder joints formed during undercooled and eutectic liquid soldering processes. Journal of Materials Science: Materials in Electronics 30:5, pages 4770-4781.
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Mohammad Faizan. (2015) Dissolution kinetics of copper in lead-free liquid solders. Soldering & Surface Mount Technology 27:2, pages 84-89.
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