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Materials and Manufacturing Processes Volume 31, 2016 - Issue 8
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Original Articles

A Study of Ta-Si-N/Ti Bilayer Diffusion Barrier for Copper/Silicon Contact Systems

Minghui DingKey Laboratory of Superlight Material and Surface Technology, Ministry of Education, Harbin Engineering University, , PR China;College of Material Science and Chemical Engineering, Harbin Engineering University, Harbin, PR China;Institute of Surface/Interface Science and Technology, Harbin Engineering University, Harbin, PR ChinaCorrespondence[email protected].
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Hang ZhengKey Laboratory of Superlight Material and Surface Technology, Ministry of Education, Harbin Engineering University, , PR China;College of Material Science and Chemical Engineering, Harbin Engineering University, Harbin, PR China;Institute of Surface/Interface Science and Technology, Harbin Engineering University, Harbin, PR China
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Li WangKey Laboratory of Superlight Material and Surface Technology, Ministry of Education, Harbin Engineering University, , PR China;College of Material Science and Chemical Engineering, Harbin Engineering University, Harbin, PR China;Institute of Surface/Interface Science and Technology, Harbin Engineering University, Harbin, PR China
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Hongsen ZhangKey Laboratory of Superlight Material and Surface Technology, Ministry of Education, Harbin Engineering University, , PR China;College of Material Science and Chemical Engineering, Harbin Engineering University, Harbin, PR China;Institute of Surface/Interface Science and Technology, Harbin Engineering University, Harbin, PR China
Pages 1009-1013 | Received 27 Nov 2014, Accepted 29 Dec 2014, Published online: 30 Aug 2015

Citations (4)

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Read on this site (1)

WenZheng Xu, XiaoHong Yuan, AnFang Wei, Quan Feng & QuFu Wei. (2018) Characterisation of PET nonwoven deposited with Ag/FC nanocomposite films. Surface Engineering 34:11, pages 838-845.
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Articles from other publishers (3)

Hongjin Liu, Mingkun Fu, Zhe Wang, Shaozhi Pang, Huaiqing Zhu, Chen Zhang, Lijun Ming, Xinyu Liu, Minghui Ding & Yudong Fu. (2022) Thermal Stability of Self-Assembled 3-Aminopropyltrimethoxysilane Diffusion Barrier Terminated by Carboxyl Groups. Applied Sciences 12:21, pages 11098.
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Rongbin Li, Minxu Li, Chunxia Jiang, Bangwei Qiao, Weiwei Zhang & Jie Xu. (2019) Thermal stability of AlCrTaTiZrMo-nitride high entropy film as a diffusion barrier for Cu metallization. Journal of Alloys and Compounds 773, pages 482-489.
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Rongbin Li, Bangwei Qiao, Hailong Shang, Jing Zhang, Chunxia Jiang & Weiwei Zhang. (2018) Multi-component AlCrTaTiZrMo-nitride film with high diffusion resistance in copper metallization. Journal of Alloys and Compounds 748, pages 258-264.
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