Citations (12)
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Karan Pawar, Harsha S & Pradeep Dixit. (2023) Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging. Materials and Manufacturing Processes 38:3, pages 284-294.
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Harshadkumar Jadav, Vishvesh Badheka, Gautam Upadhyay & Kush Mehta. (2022) Dissimilar welding of magnesium alloy to aluminium alloy: a review. Advances in Materials and Processing Technologies 8:4, pages 3794-3821.
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J. Ren & M. L. Huang. (2021) Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder. Science and Technology of Welding and Joining 26:3, pages 205-212.
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Liming Duan, Hao Jiang, Xu Zhang, Guangyao Li & Junjia Cui. (2021) Experimental investigations of electromagnetic punching process in CFRP laminate. Materials and Manufacturing Processes 36:2, pages 223-234.
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Pankul Goel, Noor Zaman Khan, Zahid A. Khan, Abdulrahman Ahmari, Namrata Gangil, Mustufa Haider Abidi & Arshad Noor Siddiquee. (2019) Investigation on material mixing during FSW of AA7475 to AISI304. Materials and Manufacturing Processes 34:2, pages 192-200.
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John Abish, Pratik Samal, M. S. Narenther, C. Kannan & A. S. S. Balan. (2018) Assessment of drilling-induced damage in CFRP under chilled air environment. Materials and Manufacturing Processes 33:12, pages 1361-1368.
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Mykhailo Stolbchenko, Olexandr Grydin & Mirko Schaper. (2018) Influence of surface roughness on the bonding quality in twin-roll cast clad strip. Materials and Manufacturing Processes 33:7, pages 727-734.
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Articles from other publishers (5)
Yuanyuan Chen, Yuan Huang, Fei Li, Lu Han, Dongguang Liu, Laima Luo, Zongqing Ma, Yongchang Liu & Zumin Wang. (2021) High-strength diffusion bonding of oxide-dispersion-strengthened tungsten and CuCrZr alloy through surface nano-activation and Cu plating. Journal of Materials Science & Technology 92, pages 186-194.
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Olivia Stanners, James Russell, Sean John, Helen M. Davies & Silvia Marchisio. (2021) Powder Interlayer Bonding of Nickel-Based Superalloys with Dissimilar Chemistries. Materials 14:8, pages 2029.
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Wenqing Song, Jin Ren, Peng He, Jingru Sun, Junmiao Shi, Jiangtao Xiong & Jinglong Li. (2021) Quantitative determination of the defects in TC4 diffusion bonded joints via ultrasonic C-scan. Journal of Manufacturing Processes 64, pages 1476-1483.
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J.T. Xiong, J.R. Sun, J.C. Wang, H. Zhang, J.M. Shi & J.L. Li. (2019) Evaluation of the bonded ratio of TC4 diffusion bonded joints based on ultrasonic C-scan. Journal of Manufacturing Processes 47, pages 238-243.
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Qingdong Zhang, Shuo Li, Jiyang Liu, Yanan Wang, Boyang Zhang & Li-Yuan Zhang. (2018) Study of a Bimetallic Interfacial Bonding Process Based on Ultrasonic Quantitative Evaluation. Metals 8:5, pages 329.
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