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Articles

Material removal in grinding sapphire wafers with brazed–diamond pellet plates

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Pages 791-799 | Received 24 Oct 2018, Accepted 17 Feb 2019, Published online: 20 Mar 2019

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Yebing Tian, Linguang Li, Jinguo Han, Zenghua Fan & Kui Liu. (2021) Development of novel high-shear and low-pressure grinding tool with flexible composite. Materials and Manufacturing Processes 36:4, pages 479-487.
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Yinhui Wang, Zhiqiang Liang, Wenxiang Zhao, Xibin Wang & Hao Wang. (2023) Anisotropic cutting mechanisms on the surface quality in ultra-precision machining of R-plane sapphire. Applied Surface Science, pages 156868.
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Shuiquan Huang, Xuliang Li, Yitian Zhao, Qiang Sun & Han Huang. (2021) A novel lapping process for single-crystal sapphire using hybrid nanoparticle suspensions. International Journal of Mechanical Sciences 191, pages 106099.
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