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Integrated Ferroelectrics
An International Journal
Volume 17, 1997 - Issue 1-4
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Device integration

Analysis of a fence-free platinum etch process

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Pages 403-419 | Published online: 19 Aug 2006

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N. Izyumskaya, Y.-I. Alivov, S.-J. Cho, H. Morkoç, H. Lee & Y.-S. Kang. (2007) Processing, Structure, Properties, and Applications of PZT Thin Films. Critical Reviews in Solid State and Materials Sciences 32:3-4, pages 111-202.
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R.F. Schnabel, G. Beitel, G. Mainka, A. Sänger, P. Bosk, Z. Chen, R. Small & C. Dehm. (2000) Patterning of noble metal electrodes and oxygen barriers by CMP. Integrated Ferroelectrics 31:1-4, pages 233-240.
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Articles from other publishers (5)

Xu Li, Haiping Zhou, Richard J. W. Hill, Martin Holland & Iain G. Thayne. (2012) A Low Damage Etching Process of Sub-100 nm Platinum Gate Line for III–V Metal–Oxide–Semiconductor Field-Effect Transistor Fabrication and the Optical Emission Spectrometry of the Inductively Coupled Plasma of SF 6 /C 4 F 8 . Japanese Journal of Applied Physics 51:1S, pages 01AB01.
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G. Mainka, G. Beitel, R. F. Schnabel, A. Saenger & C. Dehm. (2001) Chemical Mechanical Polishing of Iridium and Iridium Oxide for Damascene Processes. Journal of The Electrochemical Society 148:10, pages G552.
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R.F. Schnabel, G. Beitel, P. Bosk, C. Dehm, A. Hauser, I. Kasko, G. Mainka, T. Mikolajick, H.D. Mullegger, N. Nagel, M. Rohner, S. Poppa, C. Sama, U. Scheler & V. Weinrich. (2001) Stack capacitor integration with buried oxygen barrier using chemical mechanical polishing of noble metals. Stack capacitor integration with buried oxygen barrier using chemical mechanical polishing of noble metals.
Angus I Kingon & Stephen K Streiffer. (1999) Ferroelectric films and devices. Current Opinion in Solid State and Materials Science 4:1, pages 39-44.
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K. R. Milkove, J. A. Coffin & C. Dziobkowski. (1998) Effects of argon addition to a platinum dry etch process. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 16:3, pages 1483-1488.
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