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Integrated Ferroelectrics
An International Journal
Volume 16, 1997 - Issue 1-4
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Device intergration issues and testing

Plasma etch processing of advanced ferroelectric devices

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Pages 53-61 | Received 18 Mar 1996, Published online: 19 Aug 2006

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J. Baborowski, P. Muralt, N. Ledermann, E. Colla, A. Seifert, S. Gentil & N. Setter. (2000) Mechanisms of Pb(zr0.53Ti0.47)O3 thin film etching with ECR/RF reactor. Integrated Ferroelectrics 31:1-4, pages 261-271.
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R Ramesh, S Aggarwal & O Auciello. (2001) Science and technology of ferroelectric films and heterostructures for non-volatile ferroelectric memories. Materials Science and Engineering: R: Reports 32:6, pages 191-236.
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S. Delprat, M. Chaker & J. Margot. (2001) Investigation of the gas pressure influence on patterned platinum etching characteristics using a high-density plasma. Journal of Applied Physics 89:1, pages 29-33.
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G. Suchaneck, R. Tews & G. Gerlach. (1999) A model for reactive ion etching of PZT thin films. Surface and Coatings Technology 116-119, pages 456-460.
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