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Integrated Ferroelectrics
An International Journal
Volume 16, 1997 - Issue 1-4
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Device intergration issues and testing

A reactive ion etch study for producing patterned platinum structures

Curtis E. Farrell IBM T. J. Watson Research Center, Yorktown Heights, New York, 10598, USA; Currently employed at Materials Research Corporation, Congers, New York, 10920, USA E-mail: [email protected]
,
K. R. Milkove IBM T. J. Watson Research Center, Yorktown Heights, New York, 10598, USA
,
Cindy Wang IBM Microelectronics Division, Hopewell Junction, New York, 12533, USA
&
David E. Kotecki IBM Microelectronics Division, Hopewell Junction, New York, 12533, USA
Pages 109-138 | Received 18 Mar 1996, Published online: 19 Aug 2006

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N. Izyumskaya, Y.-I. Alivov, S.-J. Cho, H. Morkoç, H. Lee & Y.-S. Kang. (2007) Processing, Structure, Properties, and Applications of PZT Thin Films. Critical Reviews in Solid State and Materials Sciences 32:3-4, pages 111-202.
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C. Soyer, E. Fribourg-Blanc, E. Cattan & D. Rèmiens. (2005) Dry Etching of PZT Thin Films for Bilayer Actuator Realization. Integrated Ferroelectrics 69:1, pages 203-211.
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Chee Won Chung & Chang Jung Kim. (2001) Effect of etch gases on iridium etching using a hard mask. Integrated Ferroelectrics 39:1-4, pages 119-126.
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Dong-Chun Kim, Hyo-Jin Nam, William Jo, Heon-Min Lee, Seong-Moon Cho, Jong-Uk Bu & Hee-Bok Kang. (1999) Integration of a split word line ferroelectric memory using a novel etching technology. Integrated Ferroelectrics 27:1-4, pages 279-290.
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J. Baborowski, P. Muralt & N. Ledermann. (1999) Etching of platinum thin films with dual frequency ECR/RF reactor. Integrated Ferroelectrics 27:1-4, pages 243-256.
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F.G. Celii, T.S. Moise, S.R. Summerfelt, L. Archer, P. Chen, S. Gilbert, R. Beavers, S.M. Bilodeau, D.J. Vestyck, S.T. Johnston, M.W. Russell & P.C. Van Buskirk. (1999) Plasma etching and electrical characterization of Ir/IrO2/PZT/Ir FeRAM device structures. Integrated Ferroelectrics 27:1-4, pages 227-241.
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KeithR. Milkove. (1998) Dry etching of (Ba, Sr)TiO3 with Cl2, SF6, and CF4 . Integrated Ferroelectrics 21:1-4, pages 53-62.
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Articles from other publishers (14)

Yu-Chen Chen, Hsu-Hsiang Cheng, Ming-Ching Cheng, Sung-Cheng Lo, Chun-Kai Chan & Weileun Fang. (2023) On the design of a two-way piezoelectric MEMS microspeaker based on a multi-shape cantilever array for high-frequency applications. Journal of Micromechanics and Microengineering 33:7, pages 074001.
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Xu Li, Haiping Zhou, Richard J. W. Hill, Martin Holland & Iain G. Thayne. (2012) A Low Damage Etching Process of Sub-100 nm Platinum Gate Line for III–V Metal–Oxide–Semiconductor Field-Effect Transistor Fabrication and the Optical Emission Spectrometry of the Inductively Coupled Plasma of SF 6 /C 4 F 8 . Japanese Journal of Applied Physics 51:1S, pages 01AB01.
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D. J. Wouters, D. Maes, L. Goux, J. G. Lisoni, V. Paraschiv, J. A. Johnson, M. Schwitters, J.-L. Everaert, W. Boullart, M. Schaekers, M. Willegems, H. Vander Meeren, L. Haspeslagh, C. Artoni, C. Caputa, P. Casella, G. Corallo, G. Russo, R. Zambrano, H. Monchoix, G. Vecchio & L. Van Autryve. (2006) Integration of SrBi2Ta2O9 thin films for high density ferroelectric random access memory. Journal of Applied Physics 100:5.
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C. Soyer, E. Cattan & D. Rèmiens. (2005) Electrical damage induced by reactive ion-beam etching of lead-zirconate-titanate thin films. Journal of Applied Physics 97:11.
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L. Goux, V. Paraschiv, J. G. Lisoni, M. Schwitters, D. Maes, L. Haspeslagh, D. J. Wouters, P. Casella & R. Zambrano. (2005) Influence of Dry-Etch Patterning of Top Electrode and SrBi[sub 2]Ta[sub 2]O[sub 9] on the Properties of Ferroelectric Capacitors. Journal of The Electrochemical Society 152:12, pages C865.
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J. Baborowski. 2005. Electroceramic-Based MEMS. Electroceramic-Based MEMS 325 359 .
Chee Won Chung & Ilsub Chung. (2001) Etch Behavior of Pb(Zr[sub X]Ti[sub 1−X])O[sub 3] Films Using a TiO[sub 2] Hard Mask. Journal of The Electrochemical Society 148:5, pages C353.
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S. Delprat, M. Chaker & J. Margot. (2001) Investigation of the gas pressure influence on patterned platinum etching characteristics using a high-density plasma. Journal of Applied Physics 89:1, pages 29-33.
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Chee Won Chung & Ilsub Chung. (2000) Platinum etching using a TiO2 hard mask in an O2/Cl2/Ar plasma. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 18:3, pages 835-839.
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Jin Hong Kim & Seong Ihl Woo. (2000) Effects of carbon monoxide addition to chlorine plasma-treated platinum films. Applied Surface Science 156:1-4, pages 9-15.
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J Baborowski, P Muralt, N Ledermann & S Hiboux. (2000) Etching of RuO2 and Pt thin films with ECR/RF reactor. Vacuum 56:1, pages 51-56.
Crossref
Li-Hsin Chang, Elizabeth Apen, Mike Kottke & Clarence Tracy. (1998) A study of platinum electrode patterning in a reactive ion etcher. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 16:3, pages 1489-1496.
Crossref
K. R. Milkove, J. A. Coffin & C. Dziobkowski. (1998) Effects of argon addition to a platinum dry etch process. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 16:3, pages 1483-1488.
Crossref
Chee Won Chung, Inyong Song & Jong Sig Lee. (2011) Investigation of ETCH Profiles in Etching of PZT and Pt Thin Films. MRS Proceedings 493.
Crossref

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