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Machining Science and Technology
An International Journal
Volume 16, 2012 - Issue 4
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Original Articles

RESPONSE SURFACE ANALYSIS OF SLICING OF SILICON INGOTS WITH FOCUS ON PHOTOVOLTAIC APPLICATION

Ganesh Dongre Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai, India
,
Ramesh Singh Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai, India
&
Suhas S. Joshi Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai, IndiaCorrespondence[email protected]
Pages 624-652 | Published online: 04 Dec 2012

Citations (15)

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Read on this site (2)

Yogesh V. Deshpande, Atul B. Andhare & Pramod M. Padole. (2023) Application of statistical and soft computational techniques in machining of Nickel based supper-alloy using cryogenically treated tools for estimation of surface roughness. Australian Journal of Mechanical Engineering 21:5, pages 1604-1623.
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Kamlesh Joshi, Upendra V. Bhandarkar & Suhas S. Joshi. (2019) Surface integrity and wafer-thickness variation analysis of ultra-thin silicon wafers sliced using wire-EDM. Advances in Materials and Processing Technologies 5:3, pages 512-525.
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Articles from other publishers (13)

Anish Kumar, Raminder Singh & Renu Sharma. (2023) Investigation of machining characterization of solar material on WEDM process through response surface methodology. Journal of the Mechanical Behavior of Materials 32:1.
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Xuyang Zhu, Guangxian Li, John Mo & Songlin Ding. (2023) Electrical discharge machining of semiconductor materials: A review. Journal of Materials Research and Technology 25, pages 4354-4379.
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Anmol Singh Verma & Shankar Singh. 2023. Advances in Modern Machining Processes. Advances in Modern Machining Processes 215 226 .
Anmol Singh Verma & Shankar Singh. (2022) Experimental investigation and prediction modelling of slicing speed and surface roughness during wafer slicing using WEDM. Engineering Research Express 4:3, pages 035028.
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Anmol S Verma & Shankar Singh. (2022) Investigation and multi-objective optimization of monocrystalline silicon wafering using wire electro-discharge machining. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 236:13, pages 7221-7235.
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Raminder Singh & Anish Kumar. 2022. Recent Trends in Materials. Recent Trends in Materials 335 364 .
Anmol Singh Verma & Shankar Singh. (2021) Parametric optimization of silicon slicing using wire electro discharge machining. Materials Today: Proceedings 44, pages 4293-4298.
Crossref
Raminder Singh, Anish Kumar & Renu Sharma. 2021. Advances in Industrial and Production Engineering. Advances in Industrial and Production Engineering 813 824 .
Kamlesh Joshi, Pradeep Padhamnath, Upendra Bhandarkar & Suhas S. Joshi. (2019) Surface Quality and Contamination on Si Wafer Surfaces Sliced Using Wire-Electrical Discharge Machining. Journal of Engineering Materials and Technology 141:4.
Crossref
Savas Ozturk, Levent Aydin & Erdal Celik. (2018) A comprehensive study on slicing processes optimization of silicon ingot for photovoltaic applications. Solar Energy 161, pages 109-124.
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Kamlesh Joshi, A. Ananya, Upendra Bhandarkar & Suhas S. Joshi. (2017) Ultra thin silicon wafer slicing using wire-EDM for solar cell application. Materials & Design 124, pages 158-170.
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Ganesh Dongre, Sagar Zaware, Uday Dabade & Suhas S. Joshi. (2015) Multi-objective optimization for silicon wafer slicing using wire-EDM process. Materials Science in Semiconductor Processing 39, pages 793-806.
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Nadjib Drouiche, Patricia Cuellar, Fouad Kerkar, Sidali Medjahed, Nabila Boutouchent-Guerfi & Malek Ould Hamou. (2014) Recovery of solar grade silicon from kerf loss slurry waste. Renewable and Sustainable Energy Reviews 32, pages 936-943.
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