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Journal of the Air & Waste Management Association Volume 69, 2019 - Issue 12
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Articles

Effect of thermal shock process on the microstructure and peel resistance of single–sided copper clad laminates used in waste printed circuit boards

Fangfang LiuGuangdong Key Laboratory for Advanced Metallic Materials Processing, South China University of Technology, Guangzhou, Guangdong, People’s Republic of China;Department of Electromechanical Engineering, Guangdong University of Science and Technology, Dongguan, Guangdong, People’s Republic of ChinaORCID Iconhttps://orcid.org/0000-0003-2446-3643View further author information
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Bingbing WanSchool of Materials Science and Engineering, Dongguan University of Technology, Dongguan, Guangdong, People’s Republic of ChinaView further author information
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Fazhan WangGuangdong Key Laboratory for Advanced Metallic Materials Processing, South China University of Technology, Guangzhou, Guangdong, People’s Republic of ChinaView further author information
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Weiping ChenGuangdong Key Laboratory for Advanced Metallic Materials Processing, South China University of Technology, Guangzhou, Guangdong, People’s Republic of ChinaCorrespondence[email protected]
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Pages 1490-1502 | Received 04 Apr 2019, Accepted 13 Sep 2019, Published online: 28 Oct 2019

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Fangfang Liu, Weiping Chen, Bingbing Wan, Huanda Chen, Zicheng Ling, Zhiping Chen & Zhiqiang Fu. (2022) Recovery of high-grade copper from metal-rich particles of waste printed circuit boards by ball milling and sieving. Environmental Technology 43:4, pages 514-523.
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Articles from other publishers (7)

Seoyeon Yuk, Byoung Cheon Lee, Seulgi Kim, Woo Kyu Kang & Dongju Lee. (2023) Study on Silane Coupling Agent Treated Silica Nanoparticles Filled High Performance Copper Clad Laminate. Electronic Materials Letters.
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Asma Sikander, Steven Kelly, Kerstin Kuchta, Anika Sievers, Thomas Willner & Andrew S. Hursthouse. (2023) Hybrid leaching of tantalum and other valuable metals from tantalum capacitor waste. Environmental Science and Pollution Research 30:21, pages 59621-59631.
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Lijuan Wang, Xiaowei Fa, Yunzhi Tang, Juan Liao, Yuhui Tan, Ning Song, Jian Huang, Zhen Sun, Men Zhao, Weifei Liu & Man Zhao. (2023) Preparation of an ultra-low profile and high peel strength copper foil with rice-grain microstructures. Materials Advances.
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Seunghyun Cho & Youngbae Ko. (2022) Study on Effects of Nonlinear Behavior Characteristics of Prepreg Dielectric on Warpage of Substrate under Laminating Process. Polymers 14:3, pages 561.
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Kai Dean Kang, I. M. Saman K. Ilankoon, Nimila Dushyantha & Meng Nan Chong. (2021) Assessment of Pre-Treatment Techniques for Coarse Printed Circuit Boards (PCBs) Recycling. Minerals 11:10, pages 1134.
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Denis Froš, Karel Dušek & Petr Veselý. (2021) Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application. Polymers 13:19, pages 3203.
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Yushuai Xian, Youjun Tao, Fangyuan Ma & You Zhou. (2021) Recovery of Metals from Heat-Treated Printed Circuit Boards via an Enhanced Gravity Concentrator and High-Gradient Magnetic Separator. Materials 14:16, pages 4566.
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