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Science and Technology of Welding and Joining Volume 25, 2020 - Issue 3
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Research Articles

Influences of temperature and Sn-addition on microstructural evolution of Ag during FSW

T. NagiraJoining and Welding Research Institute, Osaka University, Osaka, JapanCorrespondence[email protected]
ORCID Iconhttps://orcid.org/0000-0002-2415-0623
ORCID Icon,
X. C. LiuJoining and Welding Research Institute, Osaka University, Osaka, Japan;School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an, People’s Republic of ChinaORCID Iconhttps://orcid.org/0000-0002-0313-6697
ORCID Icon,
K. UshiodaJoining and Welding Research Institute, Osaka University, Osaka, Japan
&
H. FujiiJoining and Welding Research Institute, Osaka University, Osaka, Japan
Pages 198-207 | Received 05 Jul 2019, Accepted 04 Sep 2019, Published online: 18 Sep 2019

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Read on this site (1)

T. Nagira, X.C. Liu, K. Ushioda & H. Fujii. (2020) Mechanism of grain structure development for pure Cu and Cu-30Zn with low stacking fault energy during FSW. Science and Technology of Welding and Joining 25:8, pages 669-678.
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Articles from other publishers (2)

Wei Chen Huang, Chin Hao Tsai, Pei Tzu Lee & C.R. Kao. (2022) Effects of bonding pressures on microstructure and mechanical properties of silver–tin alloy powders synthesized by ball milling for high-power electronics packaging. Journal of Materials Research and Technology 19, pages 3828-3841.
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Tomoya Nagira, Xiaochao Liu, Kohasaku Ushioda & Hidetoshi Fujii. (2021) Microstructural Evolutions of 2N Grade Pure Al and 4N Grade High-Purity Al during Friction Stir Welding. Materials 14:13, pages 3606.
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