308
Views
21
CrossRef citations to date
0
Altmetric
Part A: Materials Science

Influence of grain boundaries on the deformation resistance: insights from an investigation of deformation kinetics and microstructure of copper after predeformation by ECAP

, , &
Pages 4331-4354 | Received 06 Mar 2013, Accepted 13 Jul 2013, Published online: 23 Aug 2013

Keep up to date with the latest research on this topic with citation updates for this article.

Read on this site (2)

Fenglin Wang, Yunping Li, Xiandong Xu, Yuichiro Koizumi, Kenta Yamanaka, Huakang Bian & Akihiko Chiba. (2015) Superthermostability of nanoscale TIC-reinforced copper alloys manufactured by a two-step ball-milling process. Philosophical Magazine 95:35, pages 4035-4053.
Read now
W. Blum, J. Dvořák, P. Král, M. Petrenec, P. Eisenlohr & V. Sklenička. (2015) In situ study of microstructure and strength of severely predeformed pure Cu in deformation at 573 K. Philosophical Magazine 95:33, pages 3696-3711.
Read now

Articles from other publishers (19)

J. Bach, M. Stoiber, L. Schindler, H.W. Höppel & M. Göken. (2020) Deformation mechanisms and strain rate sensitivity of bimodal and ultrafine-grained copper. Acta Materialia 186, pages 363-373.
Crossref
Y. Xiao, V. Maier-Kiener, J. Michler, R. Spolenak & J.M. Wheeler. (2019) Deformation behavior of aluminum pillars produced by Xe and Ga focused ion beams: Insights from strain rate jump tests. Materials & Design 181, pages 107914.
Crossref
Hailiang Yu, Lin Wang, Linjiang Chai, Jintao Li, Cheng Lu, Ajit Godbole, Hui Wang & Charlie Kong. (2019) High thermal stability and excellent mechanical properties of ultrafine-grained high-purity copper sheets subjected to asymmetric cryorolling. Materials Characterization 153, pages 34-45.
Crossref
Jan Philipp Liebig, Sebastian Krauß, Mathias Göken & Benoit Merle. (2018) Influence of stacking fault energy and dislocation character on slip transfer at coherent twin boundaries studied by micropillar compression. Acta Materialia 154, pages 261-272.
Crossref
W. Blum, J. Dvořák, P. Král & V. Sklenička. (2018) Dynamic grain coarsening in creep of pure Cu at after predeformation by ECAP . Materials Science and Engineering: A 731, pages 520-529.
Crossref
Petr Král, Jiří Dvořák, Marie Kvapilová, Wolfgang Blum & Václav Sklenička. (2017) The influence of long-term annealing at room temperature on creep behaviour of ECAP-processed copper. Materials Letters 188, pages 235-238.
Crossref
W. Blum, J. Dvořák, P. Král, P. Eisenlohr & V. Sklenička. (2016) Effects of Grain Refinement by ECAP on the Deformation Resistance of Al Interpreted in Terms of Boundary-Mediated Processes. Journal of Materials Science & Technology 32:12, pages 1309-1320.
Crossref
A. Leitner, V. Maier-Kiener, J. Jeong, M.D. Abad, P. Hosemann, S.H. Oh & D. Kiener. (2016) Interface dominated mechanical properties of ultra-fine grained and nanoporous Au at elevated temperatures. Acta Materialia 121, pages 104-116.
Crossref
Frank Kümmel, Tina Hausöl, Heinz Werner Höppel & Mathias Göken. (2016) Enhanced fatigue lives in AA1050A/AA5005 laminated metal composites produced by accumulative roll bonding. Acta Materialia 120, pages 150-158.
Crossref
Yi Huang, Shima Sabbaghianrad, Abdulla I. Almazrouee, Khaled J. Al-Fadhalah, Saleh N. Alhajeri & Terence G. Langdon. (2016) The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion. Materials Science and Engineering: A 656, pages 55-66.
Crossref
C. Howard, D. Frazer, A. Lupinacci, S. Parker, R.Z. Valiev, C. Shin, B. William Choi & P. Hosemann. (2016) Investigation of specimen size effects by in-situ microcompression of equal channel angular pressed copper. Materials Science and Engineering: A 649, pages 104-113.
Crossref
Mathis Ruppert, Christopher Schunk, Daniel Hausmann, Heinz Werner Höppel & Mathias Göken. (2016) Global and local strain rate sensitivity of bimodal Al-laminates produced by accumulative roll bonding. Acta Materialia 103, pages 643-650.
Crossref
Verena Maier, Alexander Leitner, Reinhard Pippan & Daniel Kiener. (2015) Thermally Activated Deformation Behavior of ufg-Au: Environmental Issues During Long-Term and High-Temperature Nanoindentation Testing. JOM 67:12, pages 2934-2944.
Crossref
W. Blum, J. Dvořák, P. Král, P. Eisenlohr & V. Sklenička. (2015) Correct Interpretation of Creep Rates: A Case Study of Cu. Journal of Materials Science & Technology 31:11, pages 1065-1068.
Crossref
Verena Maier, Anton Hohenwarter, Reinhard Pippan & Daniel Kiener. (2015) Thermally activated deformation processes in body-centered cubic Cr – How microstructure influences strain-rate sensitivity. Scripta Materialia 106, pages 42-45.
Crossref
Mladen-Mateo Primorac, Manuel David Abad, Peter Hosemann, Marius Kreuzeder, Verena Maier & Daniel Kiener. (2015) Elevated temperature mechanical properties of novel ultra-fine grained Cu–Nb composites. Materials Science and Engineering: A 625, pages 296-302.
Crossref
Marius Kreuzeder, Manuel-David Abad, Mladen-Mateo Primorac, Peter Hosemann, Verena Maier & Daniel Kiener. (2014) Fabrication and thermo-mechanical behavior of ultra-fine porous copper. Journal of Materials Science 50:2, pages 634-643.
Crossref
W. Blum, J. Dvořák, P. Král, P. Eisenlohr & V. Sklenička. (2014) What is “stationary” deformation of pure Cu?. Journal of Materials Science 49:8, pages 2987-2997.
Crossref
W. Blum, J. Dvořák, P. Král, P. Eisenlohr & V. Sklenička. (2014) Effect of grain refinement by ECAP on creep of pure Cu. Materials Science and Engineering: A 590, pages 423-432.
Crossref

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.